XTROLOGY Trademark

Trademark Overview


On Thursday, April 3, 2025, a trademark application was filed for XTROLOGY with the United States Patent and Trademark Office. The USPTO has given the XTROLOGY trademark a serial number of 79425805. The federal status of this trademark filing is RESPONSE AFTER NON-FINAL ACTION - ENTERED as of Thursday, January 29, 2026. This trademark is owned by HORIBA STEC, Co., Ltd.. The XTROLOGY trademark is filed in the Computer & Software Products & Electrical & Scientific Products category with the following description:

Semiconductor wafer inspection apparatus, namely, inspection machines for the physical inspection of semiconductor wafers; analyzing apparatus for defect of semiconductor wafers, namely, optical analyzers for analyzing defect of semiconductor wafers; analyzing apparatus for stress of semiconductor wafers, namely, optical analyzers for analyzing stress of semiconductor wafers; analyzing apparatus for composition of semiconductor wafers, namely, optical analyzers for analyzing composition of semiconductor wafers; semiconductor wafer measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor wafers; semiconductor wafer testing equipment; semiconductor photomask inspection apparatus, namely, inspection machines for the physical inspection of semiconductor photomask substrates; analyzing apparatus for defect of semiconductor photomasks, namely, optical analyzers for analyzing defect of semiconductor ...
xtrology

General Information


Serial Number79425805
Word MarkXTROLOGY
Filing DateThursday, April 3, 2025
Status661 - RESPONSE AFTER NON-FINAL ACTION - ENTERED
Status DateThursday, January 29, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesSemiconductor wafer inspection apparatus, namely, inspection machines for the physical inspection of semiconductor wafers; analyzing apparatus for defect of semiconductor wafers, namely, optical analyzers for analyzing defect of semiconductor wafers; analyzing apparatus for stress of semiconductor wafers, namely, optical analyzers for analyzing stress of semiconductor wafers; analyzing apparatus for composition of semiconductor wafers, namely, optical analyzers for analyzing composition of semiconductor wafers; semiconductor wafer measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor wafers; semiconductor wafer testing equipment; semiconductor photomask inspection apparatus, namely, inspection machines for the physical inspection of semiconductor photomask substrates; analyzing apparatus for defect of semiconductor photomasks, namely, optical analyzers for analyzing defect of semiconductor photomasks; analyzing apparatus for stress of semiconductor photomasks, namely, optical analyzers for analyzing stress of semiconductor photomasks; analyzing apparatus for composition of semiconductor photomasks, namely, optical analyzers for analyzing composition of semiconductor photomasks; semiconductor photomask measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor photomasks; semiconductor photomask testing equipment; semiconductor reticle inspection apparatus, namely, inspection machines for the physical inspection of semiconductor reticles; analyzing apparatus for defect of semiconductor reticles, namely, optical analyzers for analyzing defect of semiconductor reticles; analyzing apparatus for stress of semiconductor reticles, namely, optical analyzers for analyzing stress of semiconductor reticles; analyzing apparatus for composition of semiconductor reticles, namely, optical analyzers for analyzing composition of semiconductor reticles; semiconductor reticle measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor reticles; semiconductor reticle testing equipment; semiconductor substrate inspection, namely, inspection machines for the physical inspection of semiconductor substrates; analyzing apparatus for defect of semiconductor substrates; analyzing apparatus for stress of semiconductor substrates, namely, optical analyzers for analyzing stress of semiconductor substrates; analyzing apparatus for composition of semiconductor substrates, namely, optical analyzers for analyzing composition of semiconductor substrates; semiconductor substrate measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements of semiconductor substrates; semiconductor substrate testing equipment; optical analyzers, namely, sensors for mapping semiconductor wafers; Raman spectrographic measurement apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition and shape using Raman spectrometers and structural parts and accessories therefor; optical analyzers, namely, Raman spectroscopic analyzing apparatus, and parts and accessories therefor; measuring apparatus, namely, scientific instrumentation for measuring film thickness; measuring apparatus, namely, scientific instrumentation for measuring film thickness, defect, stress, composition, shape and elements using spectral measurements; automated optical inspection apparatus, namely, inspection machines for the physical inspection of semiconductor substrates, semiconductor wafers, semiconductor reticles, semiconductor photomasks and semiconductor pellicles; X-ray fluorescence measuring apparatus, namely, scientific instrumentation for measuring semiconductor substrates, semiconductor wafers, semiconductor reticles, semiconductor photomasks and semiconductor pellicles using X-ray fluorescence; measuring or testing machines and instruments, namely, inspection machines for the physical inspection of semiconductor substrates, semiconductor wafers, semiconductor reticles, semiconductor photomasks and semiconductor pellicles, and structural parts and accessories therefor; photoluminescence or fluorescence microscope spectrometers, and structural components and accessories therefor; optical machines and apparatus, namely, Raman spectrometers, photoluminescence spectrometers, ellipsometers, interferometric film thickness gauges, X-ray fluorescence analyzers, and measuring instruments using laser scattering; optical machines and apparatus, namely, microscopes with viewing camera; cinematographic machines and apparatus; laboratory apparatus and instruments, namely, Raman spectrometers, photoluminescence spectrometers, ellipsometers, interferometric film thickness gauges, X-ray fluorescence analyzers, and measuring instruments using laser scattering; downloadable and recorded computer software for the inspection, defect analysis, stress analysis, composition analysis, measurement and testing of semiconductor wafers, photomasks, reticles and substrates; scanning probe microscopes; X-ray fluorescence analyzing apparatus, namely, X-ray fluorescence analyzers; rotary converters; phase modifiers; batteries and dry cells; electric meters, magnetic electricity meters, and electrical outlet testers; electric wires and cables; spectacles and safety goggles; fire alarms; gas alarms

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateThursday, June 12, 2025
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameHORIBA STEC, Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressJP

Trademark Events


Event DateEvent Description
Thursday, June 12, 2025SN ASSIGNED FOR SECT 66A APPL FROM IB
Friday, June 13, 2025NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Friday, June 13, 2025APPLICATION FILING RECEIPT MAILED
Monday, September 1, 2025ASSIGNED TO EXAMINER
Thursday, September 11, 2025NON-FINAL ACTION WRITTEN
Friday, September 12, 2025NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Thursday, October 30, 2025REFUSAL PROCESSED BY MPU
Thursday, October 30, 2025NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Saturday, November 22, 2025REFUSAL PROCESSED BY IB
Thursday, January 8, 2026TEAS CHANGE OF OWNER ADDRESS RECEIVED
Thursday, January 8, 2026APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
Thursday, January 8, 2026TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Thursday, January 8, 2026ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Thursday, January 29, 2026TEAS RESPONSE TO OFFICE ACTION RECEIVED
Thursday, January 29, 2026CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, January 29, 2026TEAS/EMAIL CORRESPONDENCE ENTERED