Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer bumping or wire bonded type, onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes for production of electrical and thermal interconnect lines and patterns circuitry, pads; Printable p...