FORTIBOND Trademark

Trademark Overview


On Thursday, January 31, 2013, a trademark application was filed for FORTIBOND with the United States Patent and Trademark Office. The USPTO has given the FORTIBOND trademark a serial number of 85837492. The federal status of this trademark filing is ABANDONED - NO STATEMENT OF USE FILED as of Monday, August 6, 2018. This trademark is owned by Fry's Metals, Inc.. The FORTIBOND trademark is filed in the Chemical Products, Paint Products, and Rubber Products categories with the following description:

Printable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer bumping or wire bonded type, onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes for production of electrical and thermal interconnect lines and patterns circuitry, pads; Printable pastes for via-fill applications; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device

Printable or dispensable or jettable inks composed of silver powder mixed with epoxy material all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device; pastes for reflective layer printing or transfer composed of silver powder mixed with epoxy material

Transferable semi-finished films for wafer-to-wafer bonding, attachment of semiconductor die either flip chip or wire bonded, onto a variety of substrates, and hermetic/near hermetic packaging; semi-finished films for reflective layer printing or transfer; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device
fortibond

General Information


Serial Number85837492
Word MarkFORTIBOND
Filing DateThursday, January 31, 2013
Status606 - ABANDONED - NO STATEMENT OF USE FILED
Status DateMonday, August 6, 2018
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, November 10, 2015

Trademark Statements


Goods and ServicesPrintable pastes for wafer bonding; Printable, dispensable or pin transferable pastes for attachment of semiconductor die either with flip chip wafer bumping or wire bonded type, onto a variety of substrates, and hermetic/near hermetic packaging; printable pastes for attachment of semiconductor packages of various types onto a variety of substrates; printable or dispensable or jettable pastes for production of electrical and thermal interconnect lines and patterns circuitry, pads; Printable pastes for via-fill applications; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device
Goods and ServicesPrintable or dispensable or jettable inks composed of silver powder mixed with epoxy material all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device; pastes for reflective layer printing or transfer composed of silver powder mixed with epoxy material
Goods and ServicesTransferable semi-finished films for wafer-to-wafer bonding, attachment of semiconductor die either flip chip or wire bonded, onto a variety of substrates, and hermetic/near hermetic packaging; semi-finished films for reflective layer printing or transfer; all used in the semiconductor and electronics industries to form an electrically and/or thermally conductive permanent bond between two surfaces as well as to form an electrical and/or thermal interconnect line and to create a reflective layer underneath or around the semiconductor device

Classification Information


International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code6 - Active
Class Status DateWednesday, February 6, 2013
Primary Code001
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class002 - Paints, varnishes, lacquers; preservatives against rust and against deterioration of wood; colorants; mordants; raw natural resins; metals in foil and powder form for painters, decorators, printers and artists.
US Class Codes006, 011, 016
Class Status Code6 - Active
Class Status DateFriday, August 8, 2014
Primary Code002
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateFriday, August 8, 2014
Primary Code017
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameALPHA ASSEMBLY SOLUTIONS INC.
Party Type21 - New Owner After Publication
Legal Entity Type03 - Corporation
AddressSOMERSET, NJ 08873

Party NameALPHA METALS, INC.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressSOUTH PLAINFIELD, NJ 07080

Party NameALPHA METALS, INC.
Party Type11 - New Owner Before Publication
Legal Entity Type03 - Corporation
AddressSOUTH PLAINFIELD, NJ 07080

Party NameFry's Metals, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSouth Plainfied, NJ 07080

Trademark Events


Event DateEvent Description
Monday, August 6, 2018ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED
Monday, August 6, 2018ABANDONMENT - NO USE STATEMENT FILED
Friday, January 5, 2018NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, January 3, 2018EXTENSION 4 GRANTED
Wednesday, January 3, 2018EXTENSION 4 FILED
Wednesday, January 3, 2018TEAS EXTENSION RECEIVED
Tuesday, July 4, 2017NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Friday, June 30, 2017EXTENSION 3 GRANTED
Friday, June 30, 2017EXTENSION 3 FILED
Friday, June 30, 2017TEAS EXTENSION RECEIVED
Tuesday, February 28, 2017ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Tuesday, February 28, 2017TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Tuesday, December 27, 2016NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Saturday, December 24, 2016EXTENSION 2 GRANTED
Tuesday, December 6, 2016EXTENSION 2 FILED
Thursday, December 22, 2016CASE ASSIGNED TO INTENT TO USE PARALEGAL
Tuesday, December 6, 2016TEAS EXTENSION RECEIVED
Wednesday, November 16, 2016AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Thursday, June 23, 2016NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, June 21, 2016EXTENSION 1 GRANTED
Tuesday, June 21, 2016EXTENSION 1 FILED
Tuesday, June 21, 2016TEAS EXTENSION RECEIVED
Wednesday, March 30, 2016TEAS CHANGE OF CORRESPONDENCE RECEIVED
Thursday, February 25, 2016NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, January 5, 2016NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, November 10, 2015OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, November 10, 2015PUBLISHED FOR OPPOSITION
Wednesday, October 21, 2015NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Thursday, October 8, 2015LAW OFFICE PUBLICATION REVIEW COMPLETED
Tuesday, October 6, 2015EXPARTE APPEAL TERMINATED
Tuesday, October 6, 2015APPROVED FOR PUB - PRINCIPAL REGISTER
Friday, October 2, 2015TEAS/EMAIL CORRESPONDENCE ENTERED
Friday, October 2, 2015CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, September 25, 2015TEAS REQUEST FOR RECONSIDERATION RECEIVED
Friday, September 25, 2015EX PARTE APPEAL-INSTITUTED
Friday, September 25, 2015JURISDICTION RESTORED TO EXAMINING ATTORNEY
Friday, September 25, 2015EXPARTE APPEAL RECEIVED AT TTAB
Sunday, March 29, 2015NOTIFICATION OF FINAL REFUSAL EMAILED
Sunday, March 29, 2015FINAL REFUSAL E-MAILED
Sunday, March 29, 2015FINAL REFUSAL WRITTEN
Thursday, March 5, 2015TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, March 5, 2015CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, March 5, 2015TEAS RESPONSE TO OFFICE ACTION RECEIVED
Friday, September 5, 2014NOTIFICATION OF NON-FINAL ACTION E-MAILED
Friday, September 5, 2014NON-FINAL ACTION E-MAILED
Friday, September 5, 2014NON-FINAL ACTION WRITTEN
Friday, August 8, 2014TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, August 7, 2014CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, August 7, 2014TEAS RESPONSE TO OFFICE ACTION RECEIVED
Friday, February 7, 2014NOTIFICATION OF NON-FINAL ACTION E-MAILED
Friday, February 7, 2014NON-FINAL ACTION E-MAILED
Friday, February 7, 2014NON-FINAL ACTION WRITTEN
Friday, January 17, 2014PREVIOUS ALLOWANCE COUNT WITHDRAWN
Sunday, January 12, 2014WITHDRAWN FROM PUB - OG REVIEW QUERY
Saturday, December 28, 2013LAW OFFICE PUBLICATION REVIEW COMPLETED
Saturday, December 28, 2013ASSIGNED TO LIE
Wednesday, December 4, 2013APPROVED FOR PUB - PRINCIPAL REGISTER
Thursday, November 14, 2013TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, November 14, 2013CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, November 14, 2013TEAS RESPONSE TO OFFICE ACTION RECEIVED
Wednesday, May 22, 2013AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Wednesday, May 15, 2013NOTIFICATION OF NON-FINAL ACTION E-MAILED
Wednesday, May 15, 2013NON-FINAL ACTION E-MAILED
Wednesday, May 15, 2013NON-FINAL ACTION WRITTEN
Wednesday, May 15, 2013ASSIGNED TO EXAMINER
Wednesday, February 6, 2013NEW APPLICATION OFFICE SUPPLIED DATA ENTERED IN TRAM
Monday, February 4, 2013NEW APPLICATION ENTERED IN TRAM