XSEMI Trademark

Trademark Overview


On Thursday, July 1, 2021, a trademark application was filed for XSEMI with the United States Patent and Trademark Office. The USPTO has given the XSEMI trademark a serial number of 90805854. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Thursday, February 2, 2023. This trademark is owned by KINGPAK TECHNOLOGY INC.. The XSEMI trademark is filed in the Computer & Software Products & Electrical & Scientific Products and Treatment & Processing of Materials Services categories with the following description:

CMOS image sensor packaging in the nature of integrated circuit assembly; Semiconductor packaging in the nature of integrated circuit assembly; Manufacturing processing of semiconductors, wafers, and integrated circuits for others; Assembly of semiconductors, wafers, and integrated circuits for others; Packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; Metal laminating; Laminating of plastic, metal, ceramic or glass sheets; Laminating of plastic sheets; Molding of plastic materials

Integrated circuit modules; Electronic integrated circuits; Circuit boards provided with integrated circuits; Semiconductor chips; Computer chips; Integrated circuit modules for use with infrared detectors; Chip carriers, namely, semiconductor chip housings; Integrated circuits; Photoelectric sensors; Infrared sensors; Optical lenses; Optical mirrors; Printed circuit boards; Rearview cameras for vehicles
xsemi

General Information


Serial Number90805854
Word MarkXSEMI
Filing DateThursday, July 1, 2021
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateThursday, February 2, 2023
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesCMOS image sensor packaging in the nature of integrated circuit assembly; Semiconductor packaging in the nature of integrated circuit assembly; Manufacturing processing of semiconductors, wafers, and integrated circuits for others; Assembly of semiconductors, wafers, and integrated circuits for others; Packaging of semiconductors, wafers, and integrated circuits for others in the nature of integrated circuit assembly; Metal laminating; Laminating of plastic, metal, ceramic or glass sheets; Laminating of plastic sheets; Molding of plastic materials
Goods and ServicesIntegrated circuit modules; Electronic integrated circuits; Circuit boards provided with integrated circuits; Semiconductor chips; Computer chips; Integrated circuit modules for use with infrared detectors; Chip carriers, namely, semiconductor chip housings; Integrated circuits; Photoelectric sensors; Infrared sensors; Optical lenses; Optical mirrors; Printed circuit boards; Rearview cameras for vehicles

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateMonday, September 13, 2021
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateMonday, September 13, 2021
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameXSEMI CORPORATION
Party Type11 - New Owner Before Publication
Legal Entity Type03 - Corporation
AddressZHUBEI CITY, HSINCHU COUNTY 302
TW

Party NameKINGPAK TECHNOLOGY INC.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressHsin-Chu County
TW

Trademark Events


Event DateEvent Description
Thursday, February 2, 2023ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND
Thursday, February 2, 2023ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Thursday, February 2, 2023ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Thursday, July 21, 2022NOTIFICATION OF FINAL REFUSAL EMAILED
Thursday, July 21, 2022FINAL REFUSAL E-MAILED
Thursday, July 21, 2022FINAL REFUSAL WRITTEN
Thursday, June 23, 2022TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, June 22, 2022CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, June 22, 2022TEAS RESPONSE TO OFFICE ACTION RECEIVED
Thursday, June 23, 2022AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Wednesday, March 30, 2022NOTIFICATION OF NON-FINAL ACTION E-MAILED
Wednesday, March 30, 2022NON-FINAL ACTION E-MAILED
Wednesday, March 30, 2022NON-FINAL ACTION WRITTEN
Wednesday, March 23, 2022ASSIGNED TO EXAMINER
Monday, September 13, 2021NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Monday, July 5, 2021NEW APPLICATION ENTERED