Trademark Overview
On Tuesday, February 10, 2026, a trademark application was filed for XIVER with the United States Patent and Trademark Office. The USPTO has given the XIVER trademark a serial number of 99643832. The federal status of this trademark filing is NON-FINAL ACTION - MAILED as of Tuesday, June 23, 2026. This trademark is owned by XIVER MEMS Foundry B.V.. The XIVER trademark is filed in the Computer & Software Products & Electrical & Scientific Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:
Manufacturing services for others in the field of micro-fabrication, wafer-level processing, thin-film deposition, micromachining, photonic device fabrication, co-packaged optics assembly, and encapsulation of electronic, photonic, micro-technological and ultrasonic components; prototype manufacturing of sensors, capacitive micromachined ultrasonic transducers (CMUTs), photonic modules, co-packaged optical components and micro-modules for others.
Engineering services; design and development of electronic, photonic, micro-technological and ultrasonic devices and systems; design and development of photonic platforms, photonic integrated circuits and co-packaged optical modules; scientific and technological research; technical consultancy in the field of micro-fabrication, photonics, materials science, device architectures and component integration; testing, analysis and evaluation of the goods of others for the purpose of certification; research and development of new products; hosting and providing temporary use of non-downloadable software, namely SaaS and PaaS, for the design, modelling, simulation, data analysis and testing of electronic, photonic, micro-technological and ultrasonic devices.
Scientific, research and industrial measuring and monitoring apparatus; electronic sensors and detectors; capacitive micromachined ultrasonic transducers (CMUTs) and arrays; ultrasonic transducers; photonic devices and components; integrated photonic circuits; co-packaged optical modules and optical transceiver components; micro-electromechanical systems (MEMS) and parts thereof; integrated circuits, semiconductor chips and wafers; thin-film, micro-fabricated and photonic components; downloadable software for the design, modelling, simulation, configuration and testing of electronic, photonic, micro-technological and ultrasonic devices.
