XGENSILICON.AI Trademark

Trademark Overview


On Thursday, March 13, 2025, a trademark application was filed for XGENSILICON.AI with the United States Patent and Trademark Office. The USPTO has given the XGENSILICON.AI trademark a serial number of 99083576. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Thursday, March 13, 2025. This trademark is owned by XgenSilicon Inc.. The XGENSILICON.AI trademark is filed in the Treatment & Processing of Materials Services, Computer & Software Products & Electrical & Scientific Products, and Computer & Software Services & Scientific Services categories with the following description:

Custom manufacture of semiconductor wafers; Custom manufacture of semiconductor circuits

Electronic chips for the manufacture of integrated circuits; Semiconductor chip sets; Multiprocessor chips; Silicon chips; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design

Design of computer chips; Computer chip design services; Development of software for chip design
xgensilicon.ai

General Information


Serial Number99083576
Word MarkXGENSILICON.AI
Filing DateThursday, March 13, 2025
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateThursday, March 13, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing3 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s)
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesCustom manufacture of semiconductor wafers; Custom manufacture of semiconductor circuits
Description of MarkThe mark consists of a geometric pattern resembling a pair of interwoven vertically oriented infinity loops positioned above the word “xgensilicon.ai”.
Goods and ServicesElectronic chips for the manufacture of integrated circuits; Semiconductor chip sets; Multiprocessor chips; Silicon chips; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design
Pseudo MarkXGENSILICON AI
Goods and ServicesDesign of computer chips; Computer chip design services; Development of software for chip design

Classification Information


International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateFriday, March 14, 2025
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateThursday, March 13, 2025
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateFriday, March 14, 2025
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameXgenSilicon Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054

Trademark Events


Event DateEvent Description
Thursday, March 13, 2025NEW APPLICATION ENTERED
Thursday, March 13, 2025APPLICATION FILING RECEIPT MAILED
Friday, August 1, 2025NOTICE OF DESIGN SEARCH CODE E-MAILED
Friday, August 1, 2025NEW APPLICATION OFFICE SUPPLIED DATA ENTERED