| Serial Number | 97068631 |
| Word Mark | WELCO |
| Filing Date | Monday, October 11, 2021 |
| Status | 700 - REGISTERED |
| Status Date | Tuesday, December 26, 2023 |
| Registration Number | 7251588 |
| Registration Date | Tuesday, December 26, 2023 |
| Mark Drawing | 4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, October 10, 2023 |
| Goods and Services | Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC) |
| Goods and Services | soldering pastes; soft solder for use in the form of a printable paste for use in microelectronic applications, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; solder pastes for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the pastes comprise solder metal and its alloys and flux for use in printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronic industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes |
| Goods and Services | conductive inks for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the inks comprising solder metal and its alloys and flux for printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronics industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes |
| Goods and Services | Chemical agents for use in soldering in the microelectronics industry; electronic-grade chemical agents for use in soldering in the microelectronics industry; chemical agents for use in screen printing, dispensing and jetting in soldering in the microelectronics industry; chemical agents for use in soldering in the microelectronics industry, namely, in the semiconductor industry; chemical agents for use in soldering in the microelectronics industry, namely, chemical agents for use in clean room applications; all the aforementioned goods preferably for use in chip-production, namely, as soldering preparations comprising solder metal alloys and flux, conductive inks comprising solder metal and its alloys and flux for use in surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of the metals; all the above mentioned goods preferably for use in chip-production, namely, electronic-grade chemical agents for use in soldering in the microelectronics industry for surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of these metals; all of the above-mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and in the field of gas and water pipes |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 010, 005, 026, 006, 001, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, November 2, 2021 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 002 - Paints, varnishes, lacquers; preservatives against rust and against deterioration of wood; colorants; mordants; raw natural resins; metals in foil and powder form for painters, decorators, printers and artists. |
| US Class Codes | 016, 006, 011 |
| Class Status Code | 6 - Active |
| Class Status Date | NOT AVAILABLE |
| Primary Code | 002 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores. |
| US Class Codes | 050, 012, 023, 014, 025, 002, 013 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, November 2, 2021 |
| Primary Code | 006 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 038, 026, 023, 036 |
| Class Status Code | 6 - Active |
| Class Status Date | NOT AVAILABLE |
| Primary Code | 009 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Heraeus Deutschland GmbH & Co. KG |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 99 - Other |
| Address | Hanau 63450 DE |
| Party Name | Heraeus Deutschland GmbH & Co. KG |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 99 - Other |
| Address | Hanau 63450 DE |
| Party Name | Heraeus Deutschland GmbH & Co. KG |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 99 - Other |
| Address | Hanau 63450 DE |
| Event Date | Event Description |
| Tuesday, December 26, 2023 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
| Tuesday, December 26, 2023 | REGISTERED-PRINCIPAL REGISTER |
| Tuesday, October 10, 2023 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Tuesday, October 10, 2023 | PUBLISHED FOR OPPOSITION |
| Wednesday, September 20, 2023 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, September 5, 2023 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Tuesday, September 5, 2023 | EXAMINER'S AMENDMENT ENTERED |
| Tuesday, September 5, 2023 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Tuesday, September 5, 2023 | EXAMINERS AMENDMENT E-MAILED |
| Tuesday, September 5, 2023 | EXAMINERS AMENDMENT -WRITTEN |
| Sunday, July 30, 2023 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Sunday, July 30, 2023 | NON-FINAL ACTION E-MAILED |
| Sunday, July 30, 2023 | NON-FINAL ACTION WRITTEN |
| Monday, April 17, 2023 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Monday, April 17, 2023 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Monday, April 17, 2023 | ASSIGNED TO LIE |
| Thursday, January 19, 2023 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Monday, July 25, 2022 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Monday, July 25, 2022 | NON-FINAL ACTION E-MAILED |
| Monday, July 25, 2022 | NON-FINAL ACTION WRITTEN |
| Thursday, July 14, 2022 | ASSIGNED TO EXAMINER |
| Tuesday, November 2, 2021 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Thursday, October 14, 2021 | NEW APPLICATION ENTERED |