Trademark Overview
On Tuesday, September 30, 2025, a trademark application was filed for WE BELIEVE MATERIALS SCIENCE CHANGES THE WORLD with the United States Patent and Trademark Office. The USPTO has given the WE BELIEVE MATERIALS SCIENCE CHANGES THE WORLD trademark a serial number of 99420761. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Tuesday, September 30, 2025. This trademark is owned by The Indium Corporation of America. The WE BELIEVE MATERIALS SCIENCE CHANGES THE WORLD trademark is filed in the Advertising, Business and Retail Services, Chemical Products, Metal Products, and Education & Entertainment Services categories with the following description:
Educational services, namely, providing seminars, non-downloadable webinars, blogs, on-line journals, and lectures in the fields of material science and engineering, automotive electronics assembly, and PCB assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, inorganic industrial compounds, fusible alloys, indium-containing fabrications, and metallic indium, gallium, germanium and tin.
Metallic goods namely, metallic nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, thermal interface metallic materials, indium-containing fabrications, and metallic indium, gallium, germanium and tin all in Class 06
Providing consumer information via a website in the fields of material science and engineering, automotive electronics assembly, and PCB assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, thermal interface materials, inorganic industrial compounds, indium-containing fabrications, and metallic indium, gallium, germanium and tin
Indium and gallium inorganic chemicals for industrial use; soldering flux