WD-II Trademark

Trademark Overview


On Tuesday, May 19, 2026, a trademark application was filed for WD-II with the United States Patent and Trademark Office. The USPTO has given the WD-II trademark a serial number of 99831680. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Tuesday, May 19, 2026. This trademark is owned by Changzhou Yayi Precision Mold Co., Ltd.. The WD-II trademark is filed in the Vehicles & Locomotive Products category with the following description:

Vehicle chassis; Hoods for vehicle engines; Vehicle running boards; Vehicle bumpers; Automotive interior trim; Automobile roof racks; Spoilers for vehicles; Roof boxes for vehicles; Spare tire carriers for vehicles; Undercarriages for vehicles
wd-ii

General Information


Serial Number99831680
Word MarkWD-II
Filing DateTuesday, May 19, 2026
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateTuesday, May 19, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesVehicle chassis; Hoods for vehicle engines; Vehicle running boards; Vehicle bumpers; Automotive interior trim; Automobile roof racks; Spoilers for vehicles; Roof boxes for vehicles; Spare tire carriers for vehicles; Undercarriages for vehicles
Pseudo MarkWD TWO
Pseudo MarkWD THE SECOND

Classification Information


International Class012 - Vehicles; apparatus for locomotion by land, air, or water.
US Class Codes019, 021, 023, 031, 035, 044
Class Status Code6 - Active
Class Status DateTuesday, May 19, 2026
Primary Code012
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameChangzhou Yayi Precision Mold Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type99 - Other
AddressChangzhou City, Jiangsu Province 213000
CN

Trademark Events


Event DateEvent Description
Tuesday, May 19, 2026NEW APPLICATION ENTERED
Tuesday, May 19, 2026APPLICATION FILING RECEIPT MAILED