VIPACK Trademark
Trademark Overview
On Monday, September 9, 2024, a trademark application was filed for VIPACK with the United States Patent and Trademark Office. The USPTO has given the VIPACK trademark a serial number of 98741387. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Monday, September 9, 2024. This trademark is owned by Advanced Semiconductor Engineering, Inc.. The VIPACK trademark is filed in the Treatment & Processing of Materials Services and Computer & Software Services & Scientific Services categories with the following description:
Etching process of semiconductor wafer; semiconductor packaging processing; etching processing of integrated circuits; semiconductor wafer-level processing; wafer foundry; integrated circuit packaging processing; manufacture of substrates, seminconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer
Technology research and development for others in the field of semiconductor related product; integrated circuits design; semiconductor packaging design; substrate design; quality inspection for semiconductors and the related products; testing of semiconductors and the related products; quality identification for semiconductors and the related products; consulting with respect to semiconductor packaging technology
General Information
| Serial Number | 98741387 |
| Word Mark | VIPACK |
| Filing Date | Monday, September 9, 2024 |
| Status | 630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER |
| Status Date | Monday, September 9, 2024 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
Trademark Statements
| Goods and Services | Etching process of semiconductor wafer; semiconductor packaging processing; etching processing of integrated circuits; semiconductor wafer-level processing; wafer foundry; integrated circuit packaging processing; manufacture of substrates, seminconductors, integrated circuits, integrated circuit boards, and wafers specified by the customer |
| Goods and Services | Technology research and development for others in the field of semiconductor related product; integrated circuits design; semiconductor packaging design; substrate design; quality inspection for semiconductors and the related products; testing of semiconductors and the related products; quality identification for semiconductors and the related products; consulting with respect to semiconductor packaging technology |
Classification Information
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, September 9, 2024 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
| US Class Codes | 100, 101 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, September 9, 2024 |
| Primary Code | 042 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
Trademark Owner History
| Party Name | Advanced Semiconductor Engineering, Inc. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Kaohsiung 811
TW |
Trademark Events
| Event Date | Event Description |
| Monday, September 9, 2024 | NEW APPLICATION ENTERED |
| Thursday, September 19, 2024 | TEAS VOLUNTARY AMENDMENT RECEIVED |
| Wednesday, November 20, 2024 | PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED |
| Wednesday, November 20, 2024 | ASSIGNED TO LIE |
