| Serial Number | 97639526 |
| Word Mark | VIPACK |
| Filing Date | Wednesday, October 19, 2022 |
| Status | 686 - PUBLISHED FOR OPPOSITION |
| Status Date | Tuesday, May 7, 2024 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 3 - Illustration: Drawing or design which also includes word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, May 7, 2024 |
| Goods and Services | Etching of semiconductor wafers; custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules; etching of integrated circuits; semiconductor wafer-level processing, namely, custom manufacture of semiconductor wafers; wafer foundry, namely, custom manufacture of semiconductor wafers; custom manufacture of integrated circuit packaging; custom manufacture of semiconductor substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers to the order and specification of customers; consulting with respect to semiconductor packaging technology, namely, consulting regarding manufacturing of semiconductor packaging |
| Description of Mark | The mark consists of the stylized word "VIPACK" to the right of an image formed of five lines depicting stylized circuits, each having a shaded circle on either end of the line. |
| Indication of Colors claimed | Color is not claimed as a feature of the mark. |
| Goods and Services | Technology research and development for others in the field of semiconductor related products; integrated circuits design; semiconductor packaging design; semiconductor substrate design; quality control inspection for semiconductors and related products; testing of semiconductors and related products; quality identification, namely, quality control inspection of semiconductors and related products; consulting with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, November 3, 2022 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
| US Class Codes | 100, 101 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, November 3, 2022 |
| Primary Code | 042 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Advanced Semiconductor Engineering, Inc. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Kaohsiung 811 TW |
| Party Name | Advanced Semiconductor Engineering, Inc. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Kaohsiung 811 TW |
| Event Date | Event Description |
| Saturday, October 22, 2022 | NEW APPLICATION ENTERED |
| Thursday, November 3, 2022 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Friday, November 4, 2022 | NOTICE OF DESIGN SEARCH CODE E-MAILED |
| Wednesday, August 2, 2023 | ASSIGNED TO EXAMINER |
| Wednesday, August 9, 2023 | NON-FINAL ACTION WRITTEN |
| Wednesday, August 9, 2023 | NON-FINAL ACTION E-MAILED |
| Wednesday, August 9, 2023 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Thursday, October 5, 2023 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Tuesday, February 27, 2024 | ASSIGNED TO LIE |
| Tuesday, February 27, 2024 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Tuesday, February 27, 2024 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Wednesday, April 3, 2024 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, April 17, 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, May 7, 2024 | PUBLISHED FOR OPPOSITION |
| Tuesday, May 7, 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |