VIAFORM MOLDABLE Trademark

Trademark Overview

On Monday, September 28, 2020, a trademark application was filed for VIAFORM MOLDABLE with the United States Patent and Trademark Office. The USPTO has given the VIAFORM MOLDABLE trademark a serial number of 90217772. The federal status of this trademark filing is ABANDONED - NO STATEMENT OF USE FILED as of Monday, June 17, 2024. This trademark is owned by Vivex Biologics Group, Inc.. The VIAFORM MOLDABLE trademark is filed in the Pharmaceutical Products category with the following description:

Bone void fillers consisting of biological materials
viaform moldable

General Information

Serial Number90217772
Word MarkVIAFORM MOLDABLE
Filing DateMonday, September 28, 2020
Status606 - ABANDONED - NO STATEMENT OF USE FILED
Status DateMonday, June 17, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, March 16, 2021

Trademark Statements

Goods and ServicesBone void fillers consisting of biological materials
Pseudo MarkVIA FORM MOLDABLE
NOT AVAILABLE"MOLDABLE"

Classification Information

International Class005 - Pharmaceutical and veterinary preparations; sanitary preparations for medical purposes; dietetic substances adapted for medical use, food for babies; plasters, materials for dressings; material for stopping teeth, dental wax; disinfectants; preparations for destroying vermin; fungicides, herbicides.
US Class Codes005, 006, 018, 044, 046, 051, 052
Class Status Code6 - Active
Class Status DateMonday, November 9, 2020
Primary Code005
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameVivex Biologics Group, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressAtlanta, GA 30339
Party NameVivex Biologics Group, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressAtlanta, GA 30339

Trademark Events

Event DateEvent Description
Monday, November 9, 2020NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, February 2, 2021ASSIGNED TO EXAMINER
Saturday, February 6, 2021EXAMINERS AMENDMENT -WRITTEN
Saturday, February 6, 2021EXAMINERS AMENDMENT E-MAILED
Thursday, October 1, 2020NEW APPLICATION ENTERED
Saturday, February 6, 2021NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Saturday, February 6, 2021APPROVED FOR PUB - PRINCIPAL REGISTER
Saturday, February 6, 2021EXAMINER'S AMENDMENT ENTERED
Tuesday, March 16, 2021OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Wednesday, February 24, 2021NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, March 16, 2021PUBLISHED FOR OPPOSITION
Tuesday, May 11, 2021NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, November 2, 2021SOU TEAS EXTENSION RECEIVED
Tuesday, November 2, 2021SOU EXTENSION 1 FILED
Tuesday, November 2, 2021SOU EXTENSION 1 GRANTED
Thursday, November 4, 2021NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, May 10, 2022SOU EXTENSION 2 FILED
Tuesday, May 10, 2022SOU TEAS EXTENSION RECEIVED
Tuesday, May 10, 2022SOU EXTENSION 2 GRANTED
Tuesday, May 9, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, November 7, 2023SOU TEAS EXTENSION RECEIVED
Thursday, May 12, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Monday, November 14, 2022SOU TEAS EXTENSION RECEIVED
Monday, November 14, 2022SOU EXTENSION 3 FILED
Monday, November 14, 2022SOU EXTENSION 3 GRANTED
Wednesday, November 16, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Saturday, May 6, 2023SOU TEAS EXTENSION RECEIVED
Saturday, May 6, 2023SOU EXTENSION 4 FILED
Saturday, May 6, 2023SOU EXTENSION 4 GRANTED
Tuesday, November 7, 2023SOU EXTENSION 5 FILED
Tuesday, November 14, 2023SOU EXTENSION 5 GRANTED
Friday, July 12, 2024ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED
Tuesday, November 14, 2023CASE ASSIGNED TO INTENT TO USE PARALEGAL
Wednesday, November 15, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Monday, June 17, 2024ABANDONMENT - NO USE STATEMENT FILED

Related Keywords

moldable viaform biological materials consisting fillers void bone