| Serial Number | 79433813 |
| Word Mark | ULTIMABOND |
| Filing Date | Friday, January 24, 2025 |
| Status | 661 - RESPONSE AFTER NON-FINAL ACTION - ENTERED |
| Status Date | Wednesday, April 29, 2026 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
| Pseudo Mark | ULTIMA BOND |
| Goods and Services | Semiconductor manufacturing machines; parts of semiconductor manufacturing machine; laminated semiconductor chip manufacturing machines; parts of laminated semiconductor chip manufacturing machines; substrate parts for semiconductor manufacturing machines, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; substrate parts for semiconductor manufacturing machines, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; substrate parts for semiconductor manufacturing machines, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp); substrate parts for semiconductor manufacturing machines, namely, ceramic substrates for holding semiconductor substrates in the semiconductor substrate fabrication process; ceramic heaters being machine parts for semiconductor manufacturing machines; electrostatic chucks being machine parts for semiconductor manufacturing machines. |
| Goods and Services | Semiconductor wafers; telecommunication machines and apparatus namely, smartphones, mobile phones, telephones, wireless communication apparatus, receivers automatic switching apparatus for telecommunication; optical modulators for optical communications, telecommunication apparatus and quantum computers; optical communication devices, namely, laser diodes, optical isolators, photo diodes, optical amplifiers, optical switches; quantum computers; quantum dot light-emitting diodes [QLED]; quantum dots, namely, crystalline semi-conductor materials; quantum sensors in the nature of accelerometers, gravimeters, atomic clocks, magnetometers, gyroscopes, acoustic sensors, interferometers, superconducting quantum interference devices (SQUIDs), and photon detectors; electrical signal producing devices, namely, oscillators, frequency generators, clock generators, crystal oscillators, atomic clocks; wafers and substrates in the nature of electronic components for optical modulators; wafers and substrates in the nature of electronic components for optical communication devices; wafers and substrates in the nature of electronic components for quantum devices; wafers and substrates in the nature of electronic components for electrical signal producing devices; structural parts of optical modulators for optical communications, for telecommunication apparatus and for quantum computers, optical communication devices, namely, laser diodes, optical isolators, photo diodes, optical amplifiers and optical switches, quantum computers, quantum dot light-emitting diodes (QLED), quantum dots, namely, crystalline semi-conductor materials, quantum sensors for environmental monitoring, medical imaging and diagnostics, semiconductor inspection, high-precision positioning and navigation systems, electrical signal producing devices, namely, oscillators, frequency generators, clock generators, crystal oscillators, atomic clocks, wafers and substrates in the nature of electronic components for optical modulators, wafers and substrates in the nature of electronic components for optical communication devices, wafers and substrates in the nature of electronic components for quantum devices, wafers and substrates in the nature of electronic components for electrical signal producing devices; integrated circuits and their structural parts; circuit boards; surface acoustic wave filters; wafers and substrates being structural parts of surface acoustic wave filters; light-emitting diodes; substrates being structural parts of light-emitting diodes; laser diodes; substrates being structural parts of laser diodes; ceramic semiconductor wafers; ceramic substrates being structural parts of electronic circuits used in semiconductor manufacturing processes. |
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, October 2, 2025 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 023, 026, 036, 038 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, October 2, 2025 |
| Primary Code | 009 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | NGK INSULATORS, LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Event Date | Event Description |
| Thursday, October 2, 2025 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Friday, October 3, 2025 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Friday, October 3, 2025 | APPLICATION FILING RECEIPT MAILED |
| Saturday, October 4, 2025 | ASSIGNED TO EXAMINER |
| Sunday, October 12, 2025 | NON-FINAL ACTION WRITTEN |
| Monday, October 13, 2025 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Friday, November 28, 2025 | REFUSAL PROCESSED BY MPU |
| Friday, November 28, 2025 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Thursday, December 18, 2025 | REFUSAL PROCESSED BY IB |
| Wednesday, April 29, 2026 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Wednesday, April 29, 2026 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Wednesday, April 29, 2026 | TEAS/EMAIL CORRESPONDENCE ENTERED |