ULTIMABOND Trademark

Trademark Overview

On Friday, January 24, 2025, a trademark application was filed for ULTIMABOND with the United States Patent and Trademark Office. The USPTO has given the ULTIMABOND trademark a serial number of 79433813. The federal status of this trademark filing is NEW APPLICATION - ASSIGNED TO EXAMINER as of Saturday, October 4, 2025. This trademark is owned by NGK INSULATORS, LTD.. The ULTIMABOND trademark is filed in the Machinery Products and Computer & Software Products & Electrical & Scientific Products categories with the following description:

Semiconductor wafers; telecommunication machines and apparatus; optical modulators; optical communication devices; quantum computers; quantum dot light-emitting diodes [QLED]; quantum dots [crystalline semi-conductor materials]; quantum sensors [semi-conductor elements]; quantum sensors [electronic components]; electronic components; electrical signal producing devices; wafers and substrates for optical modulators; wafers and substrates for optical communication devices; wafers and substrates for quantum devices; wafers and substrates for electrical signal producing devices; electronic control apparatus for machines; apparatus for processing electronic information; parts of optical modulators, optical communication devices, quantum computers, quantum dot light-emitting diodes [QLED], quantum dots [crystalline semi-conductor materials], quantum sensors [semi-conductor elements], quantum sensors [electronic components], electrical signal producing devices, wafers and substrates for optic...

Semiconductor manufacturing machines; parts and accessories of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts and accessories of laminated semiconductor chip manufacturing machines; semiconductor manufacturing equipment components, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; semiconductor manufacturing equipment components, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; semiconductor manufacturing equipment components, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp); semiconductor manufacturing equipment components, namely, ceramic substrates for holding semiconductor substrates in the semiconductor substrate fabrication ...
ultimabond

General Information

Serial Number79433813
Word MarkULTIMABOND
Filing DateFriday, January 24, 2025
Status638 - NEW APPLICATION - ASSIGNED TO EXAMINER
Status DateSaturday, October 4, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesSemiconductor wafers; telecommunication machines and apparatus; optical modulators; optical communication devices; quantum computers; quantum dot light-emitting diodes [QLED]; quantum dots [crystalline semi-conductor materials]; quantum sensors [semi-conductor elements]; quantum sensors [electronic components]; electronic components; electrical signal producing devices; wafers and substrates for optical modulators; wafers and substrates for optical communication devices; wafers and substrates for quantum devices; wafers and substrates for electrical signal producing devices; electronic control apparatus for machines; apparatus for processing electronic information; parts of optical modulators, optical communication devices, quantum computers, quantum dot light-emitting diodes [QLED], quantum dots [crystalline semi-conductor materials], quantum sensors [semi-conductor elements], quantum sensors [electronic components], electrical signal producing devices, wafers and substrates for optical modulators, wafers and substrates for optical communication devices, wafers and substrates for quantum devices, wafers and substrates for electrical signal producing devices, electronic control apparatus for machines, apparatus for processing electronic information; integrated circuits and their parts; circuit boards; wafers and substrates for electronic devices; surface acoustic wave filters; wafers and substrates for surface acoustic wave filters; light-emitting diodes; substrates for light-emitting diodes; laser diodes; substrates for laser diodes; ceramic semiconductor wafers; ceramic substrates for electronic circuits used in semiconductor manufacturing processes.
Goods and ServicesSemiconductor manufacturing machines; parts and accessories of semiconductor manufacturing machines; laminated semiconductor chip manufacturing machines; parts and accessories of laminated semiconductor chip manufacturing machines; semiconductor manufacturing equipment components, namely, ceramic substrates for arranging and temporarily bonding semiconductor chips and forming a redistribution layer on a semiconductor substrate in the semiconductor substrate fabrication process; semiconductor manufacturing equipment components, namely, ceramic substrates for processing and transporting semiconductor substrates in the semiconductor substrate fabrication process; semiconductor manufacturing equipment components, namely, ceramic substrates used in the process of semiconductor packaging, including fan-out wafer-level packaging (fowlp); semiconductor manufacturing equipment components, namely, ceramic substrates for holding semiconductor substrates in the semiconductor substrate fabrication process; ceramic heaters for semiconductor manufacturing equipment; electrostatic chucks for semiconductor manufacturing equipment.
Pseudo MarkULTIMA BOND

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateThursday, October 2, 2025
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateThursday, October 2, 2025
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameNGK INSULATORS, LTD.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressJP

Trademark Events

Event DateEvent Description
Friday, October 3, 2025NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Friday, October 3, 2025APPLICATION FILING RECEIPT MAILED
Saturday, October 4, 2025ASSIGNED TO EXAMINER
Thursday, October 2, 2025SN ASSIGNED FOR SECT 66A APPL FROM IB

Related Keywords

ultimabond semiconductor quantum substrates manufacturing devices components machines wafers optical electronic