TOWA Trademark

Trademark Overview


On Friday, January 10, 2025, a trademark application was filed for TOWA with the United States Patent and Trademark Office. The USPTO has given the TOWA trademark a serial number of 98951872. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Friday, January 10, 2025. This trademark is owned by TOWA CORPORATION. The TOWA trademark is filed in the Machinery Products category with the following description:

Semiconductor manufacturing machines and parts therefore; molds being parts of machines for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and parts therefore; cutting machines for manufacturing semiconductors and parts therefore; integrated circuits manufacturing machines and parts therefore; electronic circuits manufacturing machines and parts therefore; circuit boards manufacturing machines and parts therefore; printed wiring boards manufacturing machines and parts therefore; electronic parts manufacturing machines and parts therefore; resin sealing machines for integrated circuits; resin sealing machines for electronic circuits; resin sealing machines for circuit boards; resin sealing machines for printed wiring boards; resin sealing machines for electronic parts; molds being parts of machines for sealing resins of integrated circuits; molds being parts of machines for sealing resins of electronic circuits; molds being parts of machines for se...
towa

General Information


Serial Number98951872
Word MarkTOWA
Filing DateFriday, January 10, 2025
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateFriday, January 10, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing0 - NOT AVAILABLE
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Description of MarkThe mark consists of TOWA in stylized letters.
Goods and ServicesSemiconductor manufacturing machines and parts therefore; molds being parts of machines for manufacturing semiconductors; resin sealing machines for manufacturing semiconductors and parts therefore; cutting machines for manufacturing semiconductors and parts therefore; integrated circuits manufacturing machines and parts therefore; electronic circuits manufacturing machines and parts therefore; circuit boards manufacturing machines and parts therefore; printed wiring boards manufacturing machines and parts therefore; electronic parts manufacturing machines and parts therefore; resin sealing machines for integrated circuits; resin sealing machines for electronic circuits; resin sealing machines for circuit boards; resin sealing machines for printed wiring boards; resin sealing machines for electronic parts; molds being parts of machines for sealing resins of integrated circuits; molds being parts of machines for sealing resins of electronic circuits; molds being parts of machines for sealing resins of circuit boards; molds being parts of machines for sealing resins of printed wiring boards; molds being parts of machines for sealing resins of electronic parts; cutting machines for manufacturing integrated circuits and parts therefore; cutting machines for manufacturing electronic circuits and parts therefore; cutting machines for manufacturing circuit boards and parts therefore; cutting machines for manufacturing printed wiring boards and parts therefore; cutting machines for manufacturing electronic parts and parts therefore; plastic processing machines and parts therefore; molds being parts of machines for processing resins; molds being parts of machines for processing plastics; metalworking machines and parts therefore; molds and press dies being parts of machines for metal-forming; cutting tools for machinery; ceramic processing machines and parts therefore; ceramic cutting machines and parts therefore; glass processing machines and parts therefore; machines and apparatus for manufacturing rubber goods; laser cutting machines for manufacturing semiconductors; laser cutting machines for processing plastics; laser cutting machines for manufacturing electronic parts; laser cutting machines for metalworking; laser cutting machines for processing ceramics; laser cutting machines for processing glass; laser cutting machines for processing rubber; laser cutting machines; laser engraving machines; laser engraving machines for manufacturing semiconductors; electric laser welding machines; finishing machines for metalworking, woodworking and plastics working; cutting machines and parts therefore; industrial paper cutting machines; blades being parts of machines for cutting machines; blades being parts of machines for semiconductor manufacturing machines; blades being parts of machines for electronic parts manufacturing machines; blades being parts of machines for ceramic cutting machines; automobile parts manufacturing machines; machines for manufacturing pharmaceuticals and parts therefore; industrial machine press; cemented carbide cutting tools; molds being parts of machines for use in the manufacture of rubber goods; industrial machine press for correcting distortion of frames of semiconductor substrates; electric metal cutting machines; laser cutting machines
Indication of Colors claimedColor is not claimed as a feature of the mark.

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateFriday, January 10, 2025
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameTOWA CORPORATION
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressKyoto-shi, Kyoto 601-8105
JP

Trademark Events


Event DateEvent Description
Friday, January 10, 2025NEW APPLICATION ENTERED