| Serial Number | 79400173 |
| Word Mark | TORYZA |
| Filing Date | Monday, March 4, 2024 |
| Status | 681 - PUBLICATION/ISSUE REVIEW COMPLETE |
| Status Date | Wednesday, April 9, 2025 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, April 29, 2025 |
| Goods and Services | Surface treatment equipment for use in manufacture of semiconductors, namely, semiconductor wafer plating processing machines for use in manufacture; semiconductor manufacturing machines; metal plating machines for use in the manufacture of semiconductors; semiconductor wafers plating processing machines for use in the manufacture of semiconductors; surface treatment equipment for semiconductor wafers and integrated circuits, namely, metal plating processing machines system comprised of mixing machines, filter machines, spraying machines, plating bath machines, pumping machines, plating processing machines for use in surface treatment; semiconductor substrates manufacturing machines; semiconductor wafer processing machines; etching machines and equipment for semiconductor substrates; electrolessplating machines; electroplating machines; liquid metal processing tanks for electronic components and semiconductor wafer plating being parts of machines; chemical processing tanks being parts of machines; machines and equipment for use in manufacturing and processing electronic circuit printed boards, namely, metal plating processing machines system comprised of mixing machines, filter machines, spraying machines, plating bath machines, pumping machines, plating processing machines for use in surface treatment. |
| Goods and Services | Chemicals for use in the manufacture of semiconductors; chemical surface treatment agents for use in the manufacture of electronic components; etchants for use in the manufacture of semi-conductors; plating removing preparations, namely, chemical agents for removing metal plating from microelectronic components and semiconductors; release solvent for photoresists being solvent type processing compositions for use in the electronics industry; chemicals for use in metal plating; industrial chemicals; chemicals for use in plating; plating preparations; chemical plating solutions, namely, lithium plating solutions, sodium plating solutions, aluminum plating solutions, magnesium plating solutions, chromium plating solutions, manganese plating solutions, iron plating solutions, cobalt plating solutions, nickel plating solutions, electroless nickel plating solutions, acid copper plating solutions, copper plating solutions, electroless copper plating solutions, zinc plating solutions, gallium plating solutions, germanium plating solutions, ruthenium plating solutions, electroless ruthenium plating solutions, rhodium plating solutions, electroless rhodium plating solutions, palladium plating solutions, electroless palladium plating solutions, silver plating solutions, electroless silver plating solutions, tin plating solutions, iridium plating solutions, platinum plating solutions, electroless platinum plating solutions, gold plating solutions, electroless gold plating solutions, bismuth plating solutions, electroless bismuth plating solutions; metal plating chemical compositions; chemical additives for metal plating chemical compositions; metal surface treatment agents, namely, chemical compositions for use in metal plating processes; chemicals for use in metal surface treatment, namely, chemical compositions for use in metal plating processes; chemical preparations for use in metal industries; catalytic agents; catalysts for chemical plating processes; ungluing preparations, namely, chemical solvents and degreasing solvents for use in manufacturing processes; etching agents being etching solutions for metals; etching agents being etching solutions for the surface of aluminum and aluminum alloys; etching agents being etching solutions for the surface of glass. |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, July 18, 2024 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, July 18, 2024 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | OKUNO CHEMICAL INDUSTRIES CO., LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Event Date | Event Description |
| Thursday, July 18, 2024 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Thursday, July 25, 2024 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Thursday, July 25, 2024 | APPLICATION FILING RECEIPT MAILED |
| Wednesday, September 18, 2024 | ASSIGNED TO EXAMINER |
| Thursday, September 19, 2024 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Wednesday, September 18, 2024 | NON-FINAL ACTION WRITTEN |
| Friday, September 20, 2024 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Friday, September 20, 2024 | REFUSAL PROCESSED BY MPU |
| Saturday, October 12, 2024 | REFUSAL PROCESSED BY IB |
| Thursday, March 20, 2025 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Thursday, March 20, 2025 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Thursday, March 20, 2025 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Tuesday, April 1, 2025 | APPROVED FOR PUB - PRINCIPAL REGISTER |