| Serial Number | 98269494 |
| Word Mark | TIPHARES |
| Filing Date | Tuesday, November 14, 2023 |
| Status | 681 - PUBLICATION/ISSUE REVIEW COMPLETE |
| Status Date | Monday, September 16, 2024 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, October 22, 2024 |
| Pseudo Mark | TIP HARES |
| Goods and Services | Industrial chemicals; chemicals for use in metal plating; chemicals for use in metal plating on metals and non-metals; metal plating chemical compositions, namely, electrolytic acid copper solutions; chemical additive for use in the manufacture of metal plating solution; chemical additives for use in metal plating; chemical additives for use in metal plating on metals and non-metals; metal surface treatment chemical agents; chemical agents for metal surface cleaning; etching agents in the nature of etchants for use in semiconductor manufacture, semiconductor device fabrication, and in the manufacture of package substrate, printed circuit boards, and semiconductor packaging; chemical agents for use in the metal plating industry; chemicals and metal plating chemicals for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; plating solution being chemical composition for metal plating, metal plating solution chemical additive, metal plating chemical additives for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in semiconductor manufacture, semiconductor device fabrication, and semiconductor packaging; chemicals and metal plating chemicals for use in package substrate, and printed circuit boards; metal plating chemical compositions, namely, electrolytic acid copper solutions, plating solution chemical additive, and metal plating chemical additives for use in package substrate, and printed circuit boards; metal surface treatment chemical agents, chemical agents for metal surface cleaning for use in package substrate, and printed circuit boards |
| Translation of Words in Mark | The wording "TIPHARES" has no meaning in a foreign language. |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, December 19, 2023 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | JCU CORPORATION |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 110-0015 JP |
| Event Date | Event Description |
| Friday, November 17, 2023 | NEW APPLICATION ENTERED |
| Tuesday, December 19, 2023 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Thursday, June 20, 2024 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Thursday, June 20, 2024 | NON-FINAL ACTION E-MAILED |
| Thursday, June 20, 2024 | ASSIGNED TO EXAMINER |
| Thursday, September 12, 2024 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Thursday, June 20, 2024 | NON-FINAL ACTION WRITTEN |
| Thursday, September 12, 2024 | EXAMINERS AMENDMENT -WRITTEN |
| Thursday, September 12, 2024 | EXAMINERS AMENDMENT E-MAILED |
| Thursday, September 12, 2024 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Thursday, September 12, 2024 | EXAMINER'S AMENDMENT ENTERED |