TFLET Trademark

Trademark Overview

On Thursday, July 24, 2025, a trademark application was filed for TFLET with the United States Patent and Trademark Office. The USPTO has given the TFLET trademark a serial number of 99300655. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Thursday, July 24, 2025. This trademark is owned by HyperLight Corporation. The TFLET trademark is filed in the Computer & Software Products & Electrical & Scientific Products category with the following description:

Photonic integrated chips (PICs); photonic computer chips; photonic integrated chips (PICs) used for artificial intelligence (AI) applications; chiplets comprising one or more photonic integrated chips (PICs); optical processing technology; computer hardware; chipsets comprising one or more photonic integrated chips (PICs); Photonic integrated chips (PICs) comprising thin film lithium niobate; Photonic integrated chips (PICs) comprising thin film lithium tantalate; Photonic integrated chips (PICs) comprising a Pockels material; photonic electro-optic devices; chiplets comprising one or more photonic integrated chips (PICs) comprising thin film lithium niobate, thin film lithium tantalate, a thin film lithium containing material, or a Pockels material; chipsets comprising one or more photonic integrated chips (PICs) comprising thin film lithium niobate, thin film lithium tantalate, a thin film lithium containing material, or a Pockels material
tflet

General Information

Serial Number99300655
Word MarkTFLET
Filing DateThursday, July 24, 2025
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateThursday, July 24, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesPhotonic integrated chips (PICs); photonic computer chips; photonic integrated chips (PICs) used for artificial intelligence (AI) applications; chiplets comprising one or more photonic integrated chips (PICs); optical processing technology; computer hardware; chipsets comprising one or more photonic integrated chips (PICs); Photonic integrated chips (PICs) comprising thin film lithium niobate; Photonic integrated chips (PICs) comprising thin film lithium tantalate; Photonic integrated chips (PICs) comprising a Pockels material; photonic electro-optic devices; chiplets comprising one or more photonic integrated chips (PICs) comprising thin film lithium niobate, thin film lithium tantalate, a thin film lithium containing material, or a Pockels material; chipsets comprising one or more photonic integrated chips (PICs) comprising thin film lithium niobate, thin film lithium tantalate, a thin film lithium containing material, or a Pockels material

Classification Information

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateThursday, July 24, 2025
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameHyperLight Corporation
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressCambridge, MA 02139

Trademark Events

Event DateEvent Description
Thursday, July 24, 2025NEW APPLICATION ENTERED
Thursday, July 24, 2025APPLICATION FILING RECEIPT MAILED

Related Keywords

tflet photonic chips integrated pics comprising thin film lithium material more