TECH-BOND Trademark

Trademark Overview


On Sunday, March 16, 2003, a trademark application was filed for TECH-BOND with the United States Patent and Trademark Office. The USPTO has given the TECH-BOND trademark a serial number of 78226116. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Wednesday, March 10, 2004. The TECH-BOND trademark is filed in the Treatment & Processing of Materials Services category with the following description:

A family of products that are used in the creation and/or maintenance of molecular bonds between a wide variety of materials

General Information


Serial Number78226116
Word MarkTECH-BOND
Filing DateSunday, March 16, 2003
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateWednesday, March 10, 2004
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing1000 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesA family of products that are used in the creation and/or maintenance of molecular bonds between a wide variety of materials
Pseudo MarkTECHNICAL BOND

Classification Information


International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateWednesday, April 2, 2003
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameNOT AVAILABLE
Party Type10 - Original Applicant
Legal Entity Type01 - Individual
AddressColumbus, OH 43232

Trademark Events


Event DateEvent Description
Wednesday, March 10, 2004ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Sunday, August 24, 2003NON-FINAL ACTION E-MAILED
Friday, August 15, 2003ASSIGNED TO EXAMINER