Serial Number | 79365704 |
Word Mark | TAFCS |
Filing Date | Friday, January 20, 2023 |
Status | 700 - REGISTERED |
Status Date | Tuesday, April 2, 2024 |
Registration Number | 7341894 |
Registration Date | Tuesday, April 2, 2024 |
Mark Drawing | 4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
Published for Opposition Date | Tuesday, January 16, 2024 |
Goods and Services | Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic component in the process of producing printed circuit boards; synthetic resin insulating materials for sealing electronic component in the process of producing printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics |
Goods and Services | Pharmaceutical preparations for the treatment of viral, metabolic, endocrine, musculoskeletal, cardiovascular, cardiopulmonary, genitourinary, sexual dysfunction, oncological, hepatological, ophthalmic, respiratory, neurological, gastrointestinal, hormonal, dermatological, psychiatric, immune system, blood, infectious, pain, inflammation, sepsis, alopecia, obesity, cognitive related diseases and disorders; fumigants only for agricultural purposes; fungicides only for agricultural purposes; rat poison; insecticides; herbicides; insect-repellents only for agricultural purposes; antiseptics only for agricultural purposes; adhesives for dentures; dental composite materials; dietary supplements for humans; dietetic beverages adapted for medical purposes; dietetic foods adapted for medical purposes; dietary supplements for animals |
Goods and Services | Dyestuffs; pigments; paints for blocking light; heat-resistant paints; paints; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards; printing ink |
Goods and Services | Photopolymerization initiators being industrial chemicals; chemical additives in the nature of initiators for use in the manufacture of ultraviolet light-curable inks; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; chemicals for use in the process of producing printed circuit boards, namely, plating mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; resin compositions having thermal conductivity for use in the process of producing electronic components; plastics, unprocessed |
International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
US Class Codes | 001, 005, 006, 010, 026, 046 |
Class Status Code | 6 - Active |
Class Status Date | Monday, March 27, 2023 |
Primary Code | 001 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
International Class | 002 - Paints, varnishes, lacquers; preservatives against rust and against deterioration of wood; colorants; mordants; raw natural resins; metals in foil and powder form for painters, decorators, printers and artists. |
US Class Codes | 006, 011, 016 |
Class Status Code | 6 - Active |
Class Status Date | Monday, March 27, 2023 |
Primary Code | 002 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
International Class | 005 - Pharmaceutical and veterinary preparations; sanitary preparations for medical purposes; dietetic substances adapted for medical use, food for babies; plasters, materials for dressings; material for stopping teeth, dental wax; disinfectants; preparations for destroying vermin; fungicides, herbicides. |
US Class Codes | 005, 006, 018, 044, 046, 051, 052 |
Class Status Code | 6 - Active |
Class Status Date | Monday, March 27, 2023 |
Primary Code | 005 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
International Class | 017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal. |
US Class Codes | 001, 005, 012, 013, 035, 050 |
Class Status Code | 6 - Active |
Class Status Date | Monday, March 27, 2023 |
Primary Code | 017 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
Party Name | TAIYO HOLDINGS CO., LTD. |
Party Type | 30 - Original Registrant |
Legal Entity Type | 03 - Corporation |
Address | JP |
Party Name | TAIYO HOLDINGS CO., LTD. |
Party Type | 20 - Owner at Publication |
Legal Entity Type | 03 - Corporation |
Address | JP |
Party Name | TAIYO HOLDINGS CO., LTD. |
Party Type | 10 - Original Applicant |
Legal Entity Type | 03 - Corporation |
Address | JP |
Event Date | Event Description |
Tuesday, April 2, 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |
Tuesday, April 2, 2024 | REGISTERED-PRINCIPAL REGISTER |
Tuesday, January 16, 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
Tuesday, January 16, 2024 | PUBLISHED FOR OPPOSITION |
Saturday, January 13, 2024 | NOTIFICATION PROCESSED BY IB |
Wednesday, December 27, 2023 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
Wednesday, December 27, 2023 | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB |
Wednesday, December 27, 2023 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
Thursday, December 14, 2023 | APPROVED FOR PUB - PRINCIPAL REGISTER |
Friday, December 8, 2023 | TEAS/EMAIL CORRESPONDENCE ENTERED |
Friday, December 8, 2023 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
Friday, December 8, 2023 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
Wednesday, November 22, 2023 | REFUSAL PROCESSED BY IB |
Monday, October 30, 2023 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
Monday, October 30, 2023 | REFUSAL PROCESSED BY MPU |
Friday, October 27, 2023 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
Thursday, October 26, 2023 | NON-FINAL ACTION WRITTEN |
Thursday, October 19, 2023 | ASSIGNED TO EXAMINER |
Friday, March 31, 2023 | APPLICATION FILING RECEIPT MAILED |
Monday, March 27, 2023 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
Thursday, March 23, 2023 | SN ASSIGNED FOR SECT 66A APPL FROM IB |