SUPRAYIELD Trademark

Trademark Overview


On Friday, May 23, 2003, a trademark application was filed for SUPRAYIELD with the United States Patent and Trademark Office. The USPTO has given the SUPRAYIELD trademark a serial number of 78253546. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Friday, September 28, 2012. This trademark is owned by Süss MicroTec AG. The SUPRAYIELD trademark is filed in the Machinery Products, Computer & Software Products & Electrical & Scientific Products, Construction & Repair Services, and Computer & Software Services & Scientific Services categories with the following description:

Machines for the production of electronic, micromechanical and optical components

Optical, electric and electronic equipment for the processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with s...

Installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; installation, repair and maintenance of cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; installation, repair and maintenance of wafer m...

Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development; installation and maintenance of software for pattern recognition

General Information


Serial Number78253546
Word MarkSUPRAYIELD
Filing DateFriday, May 23, 2003
Status710 - CANCELLED - SECTION 8
Status DateFriday, September 28, 2012
Registration Number3037505
Registration DateTuesday, January 3, 2006
Mark Drawing1000 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, October 11, 2005

Trademark Statements


Goods and ServicesMachines for the production of electronic, micromechanical and optical components
Goods and ServicesOptical, electric and electronic equipment for the processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition
Goods and ServicesInstallation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; installation, repair and maintenance of cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; installation, repair and maintenance of wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; installation, repair and maintenance of probed apparatus equipped with a laser cutter or emission microscopes and working with software; installation, repair and maintenance of test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, flexible tools for pattern recognition
Goods and ServicesTechnical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development; installation and maintenance of software for pattern recognition
Pseudo MarkSUPRA YIELD

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, September 28, 2012
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, September 28, 2012
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class037 - Building construction; repair; installation services.
US Class Codes100, 103, 106
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, September 28, 2012
Primary Code037
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, September 28, 2012
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameSüss MicroTec AG
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressGarching 85748
DE

Party NameSüss MicroTec AG
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressGarching 85748
DE

Party NameSüss MicroTec AG
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressGarching 85748
DE

Trademark Events


Event DateEvent Description
Friday, September 28, 2012CANCELLED SEC. 8 (6-YR)
Tuesday, January 3, 2006REGISTERED-PRINCIPAL REGISTER
Tuesday, October 11, 2005PUBLISHED FOR OPPOSITION
Wednesday, September 21, 2005NOTICE OF PUBLICATION
Saturday, June 25, 2005LAW OFFICE PUBLICATION REVIEW COMPLETED
Friday, June 24, 2005ASSIGNED TO LIE
Tuesday, June 21, 2005APPROVED FOR PUB - PRINCIPAL REGISTER
Tuesday, June 21, 2005AMENDMENT FROM APPLICANT ENTERED
Friday, June 10, 2005CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, June 10, 2005PAPER RECEIVED
Friday, December 17, 2004INQUIRY TO SUSPENSION E-MAILED
Friday, December 17, 2004SUSPENSION INQUIRY WRITTEN
Thursday, June 17, 2004LETTER OF SUSPENSION E-MAILED
Thursday, May 27, 2004CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, May 27, 2004CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, May 27, 2004PAPER RECEIVED
Friday, November 28, 2003NON-FINAL ACTION E-MAILED
Thursday, November 20, 2003ASSIGNED TO EXAMINER
Wednesday, July 2, 2003PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED
Wednesday, July 2, 2003CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, July 22, 2003CASE FILE IN TICRS
Wednesday, July 2, 2003PAPER RECEIVED