STEALTH DICING Trademark

Trademark Overview

On Wednesday, April 15, 2015, a trademark application was filed for STEALTH DICING with the United States Patent and Trademark Office. The USPTO has given the STEALTH DICING trademark a serial number of 86598182. The federal status of this trademark filing is SECTION 8 & 15 - ACCEPTED AND ACKNOWLEDGED as of Saturday, March 22, 2025. This trademark is owned by HAMAMATSU PHOTONICS K.K.. The STEALTH DICING trademark is filed in the Treatment & Processing of Materials Services category with the following description:

Treatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
stealth dicing

General Information

Serial Number86598182
Word MarkSTEALTH DICING
Filing DateWednesday, April 15, 2015
Status702 - SECTION 8 & 15 - ACCEPTED AND ACKNOWLEDGED
Status DateSaturday, March 22, 2025
Registration Number5686410
Registration DateTuesday, February 26, 2019
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, October 27, 2015

Trademark Statements

Goods and ServicesTreatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
NOT AVAILABLE"DICING"

Classification Information

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateWednesday, April 22, 2015
Primary Code040
First Use Anywhere DateWednesday, August 31, 2016
First Use In Commerce DateWednesday, August 31, 2016

Trademark Owner History

Party NameHAMAMATSU PHOTONICS K.K.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressShizuoka 435-8558
JP
Party NameHAMAMATSU PHOTONICS K.K.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressShizuoka 435-8558
JP
Party NameHAMAMATSU PHOTONICS K.K.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressShizuoka 435-8558
JP

Trademark Events

Event DateEvent Description
Saturday, April 18, 2015NEW APPLICATION ENTERED
Wednesday, April 22, 2015NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Monday, June 22, 2015ASSIGNED TO EXAMINER
Monday, June 29, 2015NON-FINAL ACTION WRITTEN
Monday, June 29, 2015NON-FINAL ACTION E-MAILED
Monday, June 29, 2015NOTIFICATION OF NON-FINAL ACTION E-MAILED
Monday, August 10, 2015TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, August 10, 2015CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, August 11, 2015TEAS/EMAIL CORRESPONDENCE ENTERED
Friday, August 21, 2015APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, September 16, 2015ASSIGNED TO LIE
Friday, September 18, 2015LAW OFFICE PUBLICATION REVIEW COMPLETED
Wednesday, October 7, 2015NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, October 27, 2015PUBLISHED FOR OPPOSITION
Tuesday, October 27, 2015OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, December 22, 2015NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Wednesday, June 15, 2016SOU TEAS EXTENSION RECEIVED
Wednesday, June 15, 2016SOU EXTENSION 1 FILED
Wednesday, June 15, 2016SOU EXTENSION 1 GRANTED
Friday, June 17, 2016NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Thursday, December 15, 2016SOU TEAS EXTENSION RECEIVED
Thursday, December 15, 2016SOU EXTENSION 2 FILED
Thursday, December 15, 2016SOU EXTENSION 2 GRANTED
Saturday, December 17, 2016NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Friday, June 16, 2017SOU TEAS EXTENSION RECEIVED
Friday, June 16, 2017SOU EXTENSION 3 FILED
Friday, June 16, 2017SOU EXTENSION 3 GRANTED
Tuesday, June 20, 2017NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Thursday, December 21, 2017SOU TEAS EXTENSION RECEIVED
Thursday, December 21, 2017SOU EXTENSION 4 FILED
Thursday, December 21, 2017SOU EXTENSION 4 GRANTED
Saturday, December 23, 2017NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, June 6, 2018SOU TEAS EXTENSION RECEIVED
Wednesday, June 6, 2018SOU EXTENSION 5 FILED
Friday, June 8, 2018CASE ASSIGNED TO INTENT TO USE PARALEGAL
Friday, June 8, 2018SOU EXTENSION 5 GRANTED
Saturday, June 9, 2018NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, December 19, 2018TEAS STATEMENT OF USE RECEIVED
Wednesday, December 19, 2018USE AMENDMENT FILED
Thursday, December 27, 2018STATEMENT OF USE PROCESSING COMPLETE
Friday, January 18, 2019ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Saturday, January 19, 2019NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
Tuesday, February 26, 2019REGISTERED-PRINCIPAL REGISTER
Monday, February 26, 2024COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
Monday, December 2, 2024TEAS SECTION 8 & 15 RECEIVED
Saturday, March 22, 2025CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Saturday, March 22, 2025REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Saturday, March 22, 2025NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED

Related Keywords

dicing stealth treatment materials laser beam wafers namely semiconductor