| Serial Number | 98494542 |
| Word Mark | STATSCHIPPAC |
| Filing Date | Thursday, April 11, 2024 |
| Status | 686 - PUBLISHED FOR OPPOSITION |
| Status Date | Tuesday, February 11, 2025 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 5 - Drawing with word(s) / letter(s) / number(s) in Stylized form |
| Published for Opposition Date | Tuesday, February 11, 2025 |
| Goods and Services | Custom assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging, and integrated circuit chips or devices for others; providing technical information in the field of product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging, and integrated circuit chips or devices, and technical consulting and manufacturing process consulting related thereto |
| Description of Mark | The mark consists of the stylized wording STATSChipPAC. |
| Pseudo Mark | STATS CHIP PAC |
| Indication of Colors claimed | Color is not claimed as a feature of the mark. |
| Goods and Services | Software engineering services; engineering and testing services in the field of assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, for others; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing facilities featuring equipment for others for testing electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices for quality control purposes and for scientific research purposes; development and establishment of testing specifications and procedures, including wafer sorting procedures, all for the purpose of testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; final product quality testing services in the field of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; packaging design services for others in the field of packaging for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, and integrated circuit chips or devices; product research and development services relating to electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing scientific and technical information in the field of product design, product development, product engineering, and product testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, and advice and consultation relating thereto |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, April 11, 2024 |
| Primary Code | 040 |
| First Use Anywhere Date | Monday, May 6, 2024 |
| First Use In Commerce Date | Monday, May 6, 2024 |
| International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
| US Class Codes | 100, 101 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, April 11, 2024 |
| Primary Code | 042 |
| First Use Anywhere Date | Monday, May 6, 2024 |
| First Use In Commerce Date | Monday, May 6, 2024 |
| Party Name | Stats Chippac Pte. Ltd. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 99 - Other |
| Address | Singapore 768442 SG |
| Party Name | Stats Chippac Pte. Ltd. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 99 - Other |
| Address | Singapore 768442 SG |
| Event Date | Event Description |
| Thursday, April 11, 2024 | NEW APPLICATION ENTERED |
| Monday, September 23, 2024 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Friday, October 25, 2024 | PRIORITY ACTION WRITTEN |
| Thursday, October 24, 2024 | ASSIGNED TO EXAMINER |
| Friday, October 25, 2024 | PRIORITY ACTION E-MAILED |
| Monday, October 28, 2024 | TEAS AMENDMENT OF USE RECEIVED |
| Monday, October 28, 2024 | AMENDMENT TO USE PROCESSING COMPLETE |
| Monday, October 28, 2024 | USE AMENDMENT FILED |
| Wednesday, December 18, 2024 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Wednesday, December 18, 2024 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Wednesday, December 18, 2024 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Friday, October 25, 2024 | NOTIFICATION OF PRIORITY ACTION E-MAILED |
| Friday, November 8, 2024 | ATTORNEY REVIEW COMPLETED |
| Thursday, January 16, 2025 | EXAMINERS AMENDMENT -WRITTEN |
| Thursday, January 16, 2025 | EXAMINER'S AMENDMENT ENTERED |
| Thursday, January 16, 2025 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Thursday, January 16, 2025 | USE AMENDMENT ACCEPTED |
| Thursday, January 16, 2025 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Thursday, January 16, 2025 | EXAMINERS AMENDMENT E-MAILED |
| Wednesday, February 5, 2025 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, February 11, 2025 | PUBLISHED FOR OPPOSITION |
| Tuesday, February 11, 2025 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |