SOLDERBOND Trademark

Trademark Overview

On Wednesday, June 9, 1999, a trademark application was filed for SOLDERBOND with the United States Patent and Trademark Office. The USPTO has given the SOLDERBOND trademark a serial number of 75724695. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Friday, November 12, 2021. This trademark is owned by Atotech Deutschland GmbH. The SOLDERBOND trademark is filed in the Chemical Products category with the following description:

CHEMICAL PRODUCTS FOR ELECTROPLATING

General Information

Serial Number75724695
Word MarkSOLDERBOND
Filing DateWednesday, June 9, 1999
Status710 - CANCELLED - SECTION 8
Status DateFriday, November 12, 2021
Registration Number2441559
Registration DateTuesday, April 3, 2001
Mark Drawing1000 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition DateTuesday, February 1, 2000

Trademark Statements

Goods and ServicesCHEMICAL PRODUCTS FOR ELECTROPLATING
Pseudo MarkSOLDER BOND

Classification Information

International Class001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry.
US Class Codes001, 005, 006, 010, 026, 046
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, November 12, 2021
Primary Code001
First Use Anywhere DateTuesday, July 27, 1999
First Use In Commerce DateTuesday, July 27, 1999

Trademark Owner History

Party NameAtotech Deutschland GmbH
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressD-10507 Berlin
DE
Party NameAtotech Deutschland GmbH
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressD-10507 Berlin
DE
Party NameAtotech Deutschland GmbH
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressD-10507 Berlin
DE

Trademark Events

Event DateEvent Description
Friday, November 12, 2021CANCELLED SEC. 8 (10-YR)/EXPIRED SECTION 9
Friday, April 3, 2020COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Thursday, March 9, 2017TEAS CHANGE OF CORRESPONDENCE RECEIVED
Tuesday, February 28, 2017TEAS CHANGE OF CORRESPONDENCE RECEIVED
Thursday, January 27, 2011REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
Thursday, January 27, 2011REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Thursday, January 27, 2011CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Thursday, January 20, 2011TEAS SECTION 8 & 9 RECEIVED
Tuesday, November 21, 2006CASE FILE IN TICRS
Monday, October 2, 2006REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Monday, September 25, 2006ASSIGNED TO PARALEGAL
Monday, July 10, 2006REGISTERED - SEC. 8 (6-YR) & SEC. 15 FILED
Monday, July 10, 2006PAPER RECEIVED
Tuesday, April 3, 2001REGISTERED-PRINCIPAL REGISTER
Wednesday, November 15, 2000ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Tuesday, November 7, 2000ASSIGNED TO EXAMINER
Wednesday, November 1, 2000STATEMENT OF USE PROCESSING COMPLETE
Wednesday, August 9, 2000USE AMENDMENT FILED
Tuesday, April 25, 2000NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, February 1, 2000PUBLISHED FOR OPPOSITION
Thursday, December 30, 1999NOTICE OF PUBLICATION
Monday, November 8, 1999APPROVED FOR PUB - PRINCIPAL REGISTER
Thursday, July 29, 1999CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, September 22, 1999NON-FINAL ACTION MAILED
Wednesday, September 15, 1999ASSIGNED TO EXAMINER
Tuesday, September 14, 1999ASSIGNED TO EXAMINER

Related Keywords

solderbond electroplating products chemical