SMARTSIC Trademark

Trademark Overview


On Thursday, March 31, 2022, a trademark application was filed for SMARTSIC with the United States Patent and Trademark Office. The USPTO has given the SMARTSIC trademark a serial number of 79349728. The federal status of this trademark filing is FINAL REFUSAL - MAILED as of Wednesday, October 11, 2023. This trademark is owned by SOITEC. The SMARTSIC trademark is filed in the Treatment & Processing of Materials Services, Computer & Software Products & Electrical & Scientific Products, and Computer & Software Services & Scientific Services categories with the following description:

Treatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing and gluing of semiconductor material surfaces all of the above being part of custom manufacture; treatment of semiconductor substrates for microelectronics, optoelectronics, microsystems, radio frequency (RF) or power components, photonics; treatment of materials in the nature of semiconductor wafers and semiconductors; polishing semiconductor wafers; transferring a layer of materials, semiconductors or components to any media being part of custom manufacturing; treatment of materials, namely, ion implantation in materials; treatment of materials, namely, deposing layers of materials, especially Chemical Vapor Deposition or Physical Vapor Deposition of thin layers; treatment of materials, namely, custom manufacturing by sublimation, such as manufacturing by Physical Vapor Transport; treatment of materials, namely, growth of material layers, especially in epitaxy; treatment of materials, na...

Multi-layer substrates being a layered semiconductor; multilayer substrates consisting of semiconductor being a layered semiconductor for optoelectronics, microelectronics, photonics, integrated circuits, radio frequency (RF) or power electronic components, for transistors, thyristors and diodes, for microsystems, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes

Testing semiconductor materials; research and development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; research and development of new products in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of subl...
smartsic

General Information


Serial Number79349728
Word MarkSMARTSIC
Filing DateThursday, March 31, 2022
Status645 - FINAL REFUSAL - MAILED
Status DateWednesday, October 11, 2023
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesTreatment of semiconductor materials, namely, mechanical, chemical, physical treatment, polishing and gluing of semiconductor material surfaces all of the above being part of custom manufacture; treatment of semiconductor substrates for microelectronics, optoelectronics, microsystems, radio frequency (RF) or power components, photonics; treatment of materials in the nature of semiconductor wafers and semiconductors; polishing semiconductor wafers; transferring a layer of materials, semiconductors or components to any media being part of custom manufacturing; treatment of materials, namely, ion implantation in materials; treatment of materials, namely, deposing layers of materials, especially Chemical Vapor Deposition or Physical Vapor Deposition of thin layers; treatment of materials, namely, custom manufacturing by sublimation, such as manufacturing by Physical Vapor Transport; treatment of materials, namely, growth of material layers, especially in epitaxy; treatment of materials, namely, manufacturing by powder sintering processes
Goods and ServicesMulti-layer substrates being a layered semiconductor; multilayer substrates consisting of semiconductor being a layered semiconductor for optoelectronics, microelectronics, photonics, integrated circuits, radio frequency (RF) or power electronic components, for transistors, thyristors and diodes, for microsystems, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes
Goods and ServicesTesting semiconductor materials; research and development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, for devices conducting or filtering radio frequency electric currents for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; research and development of new products in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; engineering and engineering services in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering electric radio frequency currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; engineering and engineering services in the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material, semiconductor or component layer transfer on all media, in the field of ion implantation in materials, in the field of material layer deposition, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition in the field of sublimation manufacturing such as Physical Vapor Transport, in the field of powder sintering process manufacturing; technical assistance and support services, namely, technical engineering advice for the development of new products in the field of multilayer substrates, semiconductor wafers and semiconductors for integrated circuits, for electronic radio frequency (RF) or power components, for transistors, thyristors and diodes, for microsystems, for optoelectronic components, for photonic components, for electronic devices for switching or converting electrical currents, or for devices conducting or filtering radio frequency electric currents, for piezoelectric devices, for quantum cryptography devices, for light emitting diodes; technical assistance and support services, namely, technical engineering advice for the field of transferring microelectronic circuits or microsystems on all kinds of media, in the field of material layer transfer, semiconductors or components on all media, in the field of ion implantation in materials, in the field of layer deposition of materials, especially in epitaxy, in the field of Chemical Vapor Deposition or Physical Vapor Deposition, in the field of sublimation manufacturing such as being Physical Vapor Transport, in the field of powder sintering process manufacturing

Classification Information


International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateFriday, September 16, 2022
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateFriday, September 16, 2022
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateFriday, September 16, 2022
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameSOITEC
Party Type10 - Original Applicant
Legal Entity Type33 - NOT AVAILABLE
AddressFR

Trademark Events


Event DateEvent Description
Thursday, September 15, 2022SN ASSIGNED FOR SECT 66A APPL FROM IB
Friday, September 16, 2022NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, September 20, 2022APPLICATION FILING RECEIPT MAILED
Wednesday, January 18, 2023ASSIGNED TO EXAMINER
Tuesday, January 24, 2023NON-FINAL ACTION WRITTEN
Wednesday, January 25, 2023NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Sunday, March 19, 2023REFUSAL PROCESSED BY MPU
Sunday, March 19, 2023NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Thursday, April 13, 2023REFUSAL PROCESSED BY IB
Monday, September 18, 2023TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, September 18, 2023CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, September 19, 2023TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, October 11, 2023FINAL REFUSAL WRITTEN
Wednesday, October 11, 2023FINAL REFUSAL E-MAILED
Wednesday, October 11, 2023NOTIFICATION OF FINAL REFUSAL EMAILED
Wednesday, February 21, 2024NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
Wednesday, December 6, 2023ASSIGNED TO EXAMINER
Wednesday, February 21, 2024NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB
Thursday, April 11, 2024ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Monday, March 11, 2024NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
Thursday, April 11, 2024TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, April 11, 2024CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, April 11, 2024TEAS REQUEST FOR RECONSIDERATION RECEIVED
Thursday, April 11, 2024TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Thursday, April 11, 2024TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
Thursday, April 11, 2024TEAS CHANGE OF CORRESPONDENCE RECEIVED
Monday, April 29, 2024CORRECTION TRANSACTION RECEIVED FROM IB
Tuesday, May 21, 2024CORRECTION FROM IB ENTERED - NO REVIEW REQUIRED