SIGNET Trademark

Trademark Overview

On Wednesday, February 3, 2021, a trademark application was filed for SIGNET with the United States Patent and Trademark Office. The USPTO has given the SIGNET trademark a serial number of 90508261. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Tuesday, July 18, 2023. This trademark is owned by Applied Materials, Inc.. The SIGNET trademark is filed in the Rubber Products category with the following description:

Dielectric films and coatings for use in semiconductor manufacturing
signet

General Information

Serial Number90508261
Word MarkSIGNET
Filing DateWednesday, February 3, 2021
Status602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status DateTuesday, July 18, 2023
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, September 7, 2021

Trademark Statements

Goods and ServicesDielectric films and coatings for use in semiconductor manufacturing

Classification Information

International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateTuesday, May 11, 2021
Primary Code017
First Use Anywhere DateTuesday, February 15, 2022
First Use In Commerce DateTuesday, February 15, 2022

Trademark Owner History

Party NameApplied Materials, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054
Party NameApplied Materials, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054

Trademark Events

Event DateEvent Description
Saturday, February 6, 2021NEW APPLICATION ENTERED
Tuesday, May 11, 2021NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, July 27, 2021ASSIGNED TO EXAMINER
Tuesday, August 3, 2021APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, August 18, 2021NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, September 7, 2021PUBLISHED FOR OPPOSITION
Tuesday, September 7, 2021OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, November 2, 2021NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Monday, May 2, 2022SOU TEAS EXTENSION RECEIVED
Monday, May 2, 2022SOU EXTENSION 1 FILED
Monday, May 2, 2022SOU EXTENSION 1 GRANTED
Wednesday, May 4, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, November 1, 2022TEAS STATEMENT OF USE RECEIVED
Tuesday, November 1, 2022USE AMENDMENT FILED
Monday, November 21, 2022CASE ASSIGNED TO INTENT TO USE PARALEGAL
Wednesday, November 30, 2022STATEMENT OF USE PROCESSING COMPLETE
Thursday, December 22, 2022SU - NON-FINAL ACTION - WRITTEN
Thursday, December 22, 2022NON-FINAL ACTION E-MAILED
Thursday, December 22, 2022NOTIFICATION OF NON-FINAL ACTION E-MAILED
Friday, March 17, 2023APPLICATION EXTENSION TO RESPONSE PERIOD - RECEIVED
Friday, March 17, 2023APPLICATION EXTENSION GRANTED/RECEIPT PROVIDED
Tuesday, July 18, 2023ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Tuesday, July 18, 2023ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND
Tuesday, July 18, 2023ABANDONMENT NOTICE E-MAILED - FAILURE TO RESPOND

Related Keywords

signet manufacturing semiconductor coatings films dielectric