Trademark Overview
On Tuesday, February 10, 2026, a trademark application was filed for SAMSUNG 2.3D CUBE-E with the United States Patent and Trademark Office. The USPTO has given the SAMSUNG 2.3D CUBE-E trademark a serial number of 99644886. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Tuesday, February 10, 2026. This trademark is owned by SAMSUNG ELECTRONICS CO., LTD.. The SAMSUNG 2.3D CUBE-E trademark is filed in the Computer & Software Products & Electrical & Scientific Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:
Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets.
Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others.
Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing.
