QSTACK Trademark

Trademark Overview


On Monday, June 26, 2023, a trademark application was filed for QSTACK with the United States Patent and Trademark Office. The USPTO has given the QSTACK trademark a serial number of 79378214. The federal status of this trademark filing is PUBLISHED FOR OPPOSITION as of Tuesday, September 24, 2024. This trademark is owned by QURV TECHNOLOGIES S.L.. The QSTACK trademark is filed in the Computer & Software Products & Electrical & Scientific Products and Computer & Software Services & Scientific Services categories with the following description:

Imaging sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; vision sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; image sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; infrared sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; light sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; optical sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; image processors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; image processing apparatus for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; semiconductors; semiconductor devices; chips being integrated circuits; system on a chip (SoC); cameras; infrared cameras

Design and development of sensors, vision sensors, image sensors, infrared sensors, light sensors, optical sensors, image processors, image processing apparatus, virtual and augmented reality hardware, semiconductors, semiconductor devices, integrated circuit chips, system on a chip (SoC), cameras and infrared cameras for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; research in the area of semiconductor processing technology; technical consultancy in relation to the production of semiconductors, sensors and integrated circuit chips for use in connection with 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; research and development of new products for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging
qstack

General Information


Serial Number79378214
Word MarkQSTACK
Filing DateMonday, June 26, 2023
Status686 - PUBLISHED FOR OPPOSITION
Status DateTuesday, September 24, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, September 24, 2024

Trademark Statements


Goods and ServicesImaging sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; vision sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; image sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; infrared sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; light sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; optical sensors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; image processors for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; image processing apparatus for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; semiconductors; semiconductor devices; chips being integrated circuits; system on a chip (SoC); cameras; infrared cameras
Goods and ServicesDesign and development of sensors, vision sensors, image sensors, infrared sensors, light sensors, optical sensors, image processors, image processing apparatus, virtual and augmented reality hardware, semiconductors, semiconductor devices, integrated circuit chips, system on a chip (SoC), cameras and infrared cameras for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; research in the area of semiconductor processing technology; technical consultancy in relation to the production of semiconductors, sensors and integrated circuit chips for use in connection with 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging; research and development of new products for 2D imaging, 3D imaging, geo-localisation, mapping and multispectral imaging

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateFriday, September 8, 2023
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateFriday, September 8, 2023
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameQURV TECHNOLOGIES S.L.
Party Type20 - Owner at Publication
Legal Entity Type16 - Limited Liability Company
AddressES

Party NameQURV TECHNOLOGIES S.L.
Party Type10 - Original Applicant
Legal Entity Type16 - Limited Liability Company
AddressES

Trademark Events


Event DateEvent Description
Thursday, September 7, 2023SN ASSIGNED FOR SECT 66A APPL FROM IB
Friday, September 8, 2023NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, September 12, 2023APPLICATION FILING RECEIPT MAILED
Tuesday, March 12, 2024ASSIGNED TO EXAMINER
Wednesday, April 3, 2024REFUSAL PROCESSED BY MPU
Wednesday, April 24, 2024REFUSAL PROCESSED BY IB
Tuesday, July 30, 2024CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, July 30, 2024TEAS/EMAIL CORRESPONDENCE ENTERED
Tuesday, July 30, 2024TEAS RESPONSE TO OFFICE ACTION RECEIVED
Friday, August 16, 2024NOTIFICATION OF NOTICE OF UNRESPONSIVE AMENDMENT - E-MAILED
Friday, August 16, 2024NOTICE OF UNRESPONSIVE AMENDMENT - E-MAILED
Friday, August 16, 2024REPORT UNRESPONSIVE AMENDMENT - COMPLETED
Monday, August 19, 2024CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, August 19, 2024TEAS/EMAIL CORRESPONDENCE ENTERED
Monday, August 19, 2024TEAS RESPONSE TO OFFICE ACTION RECEIVED
Thursday, August 22, 2024APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, September 4, 2024NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, September 24, 2024PUBLISHED FOR OPPOSITION
Tuesday, September 24, 2024OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Friday, March 15, 2024NON-FINAL ACTION WRITTEN
Saturday, March 16, 2024NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Wednesday, April 3, 2024NON-FINAL ACTION MAILED - REFUSAL SENT TO IB