QCIA-ILI Trademark

Trademark Overview


On Wednesday, September 3, 2025, a trademark application was filed for QCIA-ILI with the United States Patent and Trademark Office. The USPTO has given the QCIA-ILI trademark a serial number of 99371953. The federal status of this trademark filing is RESPONSE AFTER NON-FINAL ACTION - ENTERED as of Friday, July 17, 2026. The QCIA-ILI trademark is filed in the Computer & Software Products & Electrical & Scientific Products category with the following description:

Semiconductor substrates incorporating integrated interconnect structures; semiconductor substrates supporting localized electrical interconnects; semiconductor substrates supporting die-to-die and chiplet-to-chiplet communication; semiconductor substrates incorporating embedded bridge interconnects; silicon and silicon carbide substrates incorporating high-density signal-routing structures; semiconductor package substrates supporting heterogeneous integration and integrated-circuit connectivity; semiconductor substrates incorporating embedded, bridge-like and monolithic interconnect structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and advanced semiconductor packaging applications.
qcia-ili

General Information


Serial Number99371953
Word MarkQCIA-ILI
Filing DateWednesday, September 3, 2025
Status661 - RESPONSE AFTER NON-FINAL ACTION - ENTERED
Status DateFriday, July 17, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Pseudo MarkQCIA ILI
Goods and ServicesSemiconductor substrates incorporating integrated interconnect structures; semiconductor substrates supporting localized electrical interconnects; semiconductor substrates supporting die-to-die and chiplet-to-chiplet communication; semiconductor substrates incorporating embedded bridge interconnects; silicon and silicon carbide substrates incorporating high-density signal-routing structures; semiconductor package substrates supporting heterogeneous integration and integrated-circuit connectivity; semiconductor substrates incorporating embedded, bridge-like and monolithic interconnect structures; semiconductor substrates for AI, HPC, communications, aerospace, defense, and advanced semiconductor packaging applications.

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateWednesday, September 3, 2025
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameNOT AVAILABLE
Party Type10 - Original Applicant
Legal Entity Type01 - Individual
AddressScottsdale, AZ 85258
US

Trademark Events


Event DateEvent Description
Wednesday, September 3, 2025NEW APPLICATION ENTERED
Wednesday, September 3, 2025APPLICATION FILING RECEIPT MAILED
Thursday, January 22, 2026NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Friday, January 23, 2026ASSIGNED TO EXAMINER
Friday, April 17, 2026NON-FINAL ACTION WRITTEN
Friday, April 17, 2026NON-FINAL ACTION E-MAILED
Friday, April 17, 2026NOTIFICATION OF NON-FINAL ACTION E-MAILED
Friday, July 17, 2026TEAS RESPONSE TO OFFICE ACTION RECEIVED
Friday, July 17, 2026CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, July 17, 2026TEAS/EMAIL CORRESPONDENCE ENTERED