QCIA Trademark

Trademark Overview


On Wednesday, January 25, 2023, a trademark application was filed for QCIA with the United States Patent and Trademark Office. The USPTO has given the QCIA trademark a serial number of 97767075. The federal status of this trademark filing is NOTICE OF ALLOWANCE - ISSUED as of Tuesday, June 18, 2024. The QCIA trademark is filed in the Computer & Software Products & Electrical & Scientific Products and Computer & Software Services & Scientific Services categories with the following description:

Silicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; s...

Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking
qcia

General Information


Serial Number97767075
Word MarkQCIA
Filing DateWednesday, January 25, 2023
Status688 - NOTICE OF ALLOWANCE - ISSUED
Status DateTuesday, June 18, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, April 23, 2024

Trademark Statements


Goods and ServicesSilicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; semiconductor power components, namely, interposers for semiconductor packaging, chips and circuit boards; semiconductor packaging materials in the nature of semiconductor interposers, semiconductor substrates, semiconductor routing layers for packaging, packaging substrates, packaging thermal management substrates, packaging heat spreading device, packaging power delivery device
Goods and ServicesResearch, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateMonday, February 13, 2023
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateMonday, February 13, 2023
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameNOT AVAILABLE
Party Type20 - Owner at Publication
Legal Entity Type01 - Individual
AddressScottsdale, AZ 85258

Party NameNOT AVAILABLE
Party Type10 - Original Applicant
Legal Entity Type01 - Individual
AddressScottsdale, AZ 85258

Trademark Events


Event DateEvent Description
Saturday, January 28, 2023NEW APPLICATION ENTERED
Monday, February 13, 2023NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Tuesday, October 24, 2023ASSIGNED TO EXAMINER
Monday, November 13, 2023PRIORITY ACTION WRITTEN
Monday, November 13, 2023PRIORITY ACTION E-MAILED
Monday, November 13, 2023NOTIFICATION OF PRIORITY ACTION E-MAILED
Monday, February 12, 2024TEAS RESPONSE TO OFFICE ACTION RECEIVED
Monday, February 12, 2024CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, February 12, 2024TEAS/EMAIL CORRESPONDENCE ENTERED
Tuesday, March 19, 2024APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, April 3, 2024NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Wednesday, April 3, 2024NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, April 23, 2024PUBLISHED FOR OPPOSITION
Tuesday, April 23, 2024OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, June 18, 2024NOA E-MAILED - SOU REQUIRED FROM APPLICANT