Serial Number | 97767075 |
Word Mark | QCIA |
Filing Date | Wednesday, January 25, 2023 |
Status | 730 - FIRST EXTENSION - GRANTED |
Status Date | Tuesday, December 17, 2024 |
Registration Number | 0000000 |
Registration Date | NOT AVAILABLE |
Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
Published for Opposition Date | Tuesday, April 23, 2024 |
Goods and Services | Silicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; semiconductor power components, namely, interposers for semiconductor packaging, chips and circuit boards; semiconductor packaging materials in the nature of semiconductor interposers, semiconductor substrates, semiconductor routing layers for packaging, packaging substrates, packaging thermal management substrates, packaging heat spreading device, packaging power delivery device |
Goods and Services | Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking |
International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
US Class Codes | 021, 023, 026, 036, 038 |
Class Status Code | 6 - Active |
Class Status Date | Monday, February 13, 2023 |
Primary Code | 009 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
US Class Codes | 100, 101 |
Class Status Code | 6 - Active |
Class Status Date | Monday, February 13, 2023 |
Primary Code | 042 |
First Use Anywhere Date | NOT AVAILABLE |
First Use In Commerce Date | NOT AVAILABLE |
Party Name | NOT AVAILABLE |
Party Type | 20 - Owner at Publication |
Legal Entity Type | 01 - Individual |
Address | Scottsdale, AZ 85258 |
Party Name | NOT AVAILABLE |
Party Type | 10 - Original Applicant |
Legal Entity Type | 01 - Individual |
Address | Scottsdale, AZ 85258 |
Event Date | Event Description |
Monday, November 13, 2023 | PRIORITY ACTION E-MAILED |
Saturday, January 28, 2023 | NEW APPLICATION ENTERED |
Monday, February 13, 2023 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
Tuesday, October 24, 2023 | ASSIGNED TO EXAMINER |
Monday, November 13, 2023 | PRIORITY ACTION WRITTEN |
Monday, November 13, 2023 | NOTIFICATION OF PRIORITY ACTION E-MAILED |
Monday, February 12, 2024 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
Monday, February 12, 2024 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
Monday, February 12, 2024 | TEAS/EMAIL CORRESPONDENCE ENTERED |
Tuesday, March 19, 2024 | APPROVED FOR PUB - PRINCIPAL REGISTER |
Wednesday, April 3, 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
Tuesday, April 23, 2024 | PUBLISHED FOR OPPOSITION |
Wednesday, April 3, 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
Tuesday, April 23, 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
Tuesday, June 18, 2024 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
Tuesday, December 17, 2024 | SOU TEAS EXTENSION RECEIVED |
Tuesday, December 17, 2024 | SOU EXTENSION 1 FILED |
Tuesday, December 17, 2024 | SOU EXTENSION 1 GRANTED |
Monday, March 3, 2025 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |