PURGE LAYER DEPOSITION Trademark

Trademark Overview

On Saturday, July 24, 2004, a trademark application was filed for PURGE LAYER DEPOSITION with the United States Patent and Trademark Office. The USPTO has given the PURGE LAYER DEPOSITION trademark a serial number of 78456163. The federal status of this trademark filing is ABANDONED - NO STATEMENT OF USE FILED as of Monday, June 15, 2009. This trademark is owned by APPLIED MATERIALS, INC.. The PURGE LAYER DEPOSITION trademark is filed in the Machinery Products category with the following description:

Machines and components therefor for the processing and production of semiconductor substrates, thin films, silicon discs and wafers
purge layer deposition

General Information

Serial Number78456163
Word MarkPURGE LAYER DEPOSITION
Filing DateSaturday, July 24, 2004
Status606 - ABANDONED - NO STATEMENT OF USE FILED
Status DateMonday, June 15, 2009
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, February 20, 2007

Trademark Statements

Disclaimer with Predetermined TextPURGE LAYER
Goods and ServicesMachines and components therefor for the processing and production of semiconductor substrates, thin films, silicon discs and wafers

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code6 - Active
Class Status DateTuesday, August 3, 2004
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameAPPLIED MATERIALS, INC.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95054
Party NameAPPLIED MATERIALS, INC.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressSanta Clara, CA 95052

Trademark Events

Event DateEvent Description
Monday, June 15, 2009ABANDONMENT NOTICE MAILED - NO USE STATEMENT FILED
Monday, June 15, 2009ABANDONMENT - NO USE STATEMENT FILED
Monday, May 18, 2009ASSIGNED TO EXAMINER
Saturday, November 1, 2008EXPARTE APPEAL TERMINATED
Thursday, September 25, 2008EXTENSION 3 GRANTED
Tuesday, September 23, 2008EXTENSION 3 FILED
Thursday, September 25, 2008CASE ASSIGNED TO INTENT TO USE PARALEGAL
Tuesday, September 23, 2008TEAS EXTENSION RECEIVED
Tuesday, May 20, 2008EXTENSION 2 GRANTED
Thursday, May 8, 2008EXTENSION 2 FILED
Thursday, May 8, 2008TEAS EXTENSION RECEIVED
Friday, December 7, 2007EXTENSION 1 GRANTED
Wednesday, November 7, 2007EXTENSION 1 FILED
Wednesday, November 7, 2007TEAS EXTENSION RECEIVED
Tuesday, May 15, 2007NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, February 20, 2007PUBLISHED FOR OPPOSITION
Wednesday, January 31, 2007NOTICE OF PUBLICATION
Thursday, December 28, 2006LAW OFFICE PUBLICATION REVIEW COMPLETED
Friday, December 22, 2006APPROVED FOR PUB - PRINCIPAL REGISTER
Friday, December 22, 2006AMENDMENT FROM APPLICANT ENTERED
Friday, December 22, 2006CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, December 22, 2006ASSIGNED TO LIE
Tuesday, November 21, 2006PAPER RECEIVED
Friday, October 6, 2006ASSIGNED TO EXAMINER
Thursday, June 15, 2006NON-FINAL ACTION MAILED
Wednesday, June 14, 2006NON-FINAL ACTION WRITTEN
Thursday, February 16, 2006EX PARTE APPEAL-INSTITUTED
Thursday, February 16, 2006JURISDICTION RESTORED TO EXAMINING ATTORNEY
Tuesday, February 14, 2006EXPARTE APPEAL RECEIVED AT TTAB
Thursday, August 11, 2005FINAL REFUSAL MAILED
Thursday, August 11, 2005FINAL REFUSAL WRITTEN
Thursday, July 14, 2005AMENDMENT FROM APPLICANT ENTERED
Wednesday, July 6, 2005CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, July 6, 2005PAPER RECEIVED
Monday, February 28, 2005NON-FINAL ACTION MAILED
Monday, February 28, 2005NON-FINAL ACTION WRITTEN
Monday, February 28, 2005ASSIGNED TO EXAMINER
Tuesday, August 3, 2004NEW APPLICATION ENTERED IN TRAM

Related Keywords

deposition layer purge films thin silicon discs wafers substrates semiconductor components therefor processing