POSPEC Trademark
Trademark Overview
On Wednesday, September 20, 1995, a trademark application was filed for POSPEC with the United States Patent and Trademark Office. The USPTO has given the POSPEC trademark a serial number of 74735250. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Saturday, May 22, 2004. This trademark is owned by Electroplating Engineers of Japan Ltd.. The POSPEC trademark is filed in the Machinery Products category with the following description:
inspection sorting machine for plated bump height and bump size of semiconductor wafer
General Information
| Serial Number | 74735250 |
| Word Mark | POSPEC |
| Filing Date | Wednesday, September 20, 1995 |
| Status | 710 - CANCELLED - SECTION 8 |
| Status Date | Saturday, May 22, 2004 |
| Registration Number | 2088616 |
| Registration Date | Tuesday, August 19, 1997 |
| Mark Drawing | 1000 - Typeset: Word(s) / letter(s) / number(s) |
| Published for Opposition Date | Tuesday, May 27, 1997 |
Trademark Statements
| Goods and Services | inspection sorting machine for plated bump height and bump size of semiconductor wafer |
Classification Information
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 031, 034, 035 |
| Class Status Code | 2 - Sec. 8 - Entire Registration |
| Class Status Date | Saturday, May 22, 2004 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
Trademark Owner History
| Party Name | Electroplating Engineers of Japan Ltd. |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 03 - Corporation |
| Address | Chuo-ku, Tokyo
JP |
| Party Name | Electroplating Engineers of Japan Ltd. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Chuo-ku, Tokyo
JP |
| Party Name | Electroplating Engineers of Japan Ltd. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Chuo-ku, Tokyo
JP |
Trademark Events
| Event Date | Event Description |
| Saturday, May 22, 2004 | CANCELLED SEC. 8 (6-YR) |
| Tuesday, August 19, 1997 | REGISTERED-PRINCIPAL REGISTER |
| Tuesday, May 27, 1997 | PUBLISHED FOR OPPOSITION |
| Friday, April 25, 1997 | NOTICE OF PUBLICATION |
| Thursday, September 26, 1996 | Sec. 1(B) CLAIM DELETED |
| Thursday, February 20, 1997 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Thursday, September 26, 1996 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Monday, April 1, 1996 | NON-FINAL ACTION MAILED |
| Wednesday, March 20, 1996 | ASSIGNED TO EXAMINER |
