PLANARION Trademark

Trademark Overview

On Friday, July 26, 2024, a trademark application was filed for PLANARION with the United States Patent and Trademark Office. The USPTO has given the PLANARION trademark a serial number of 98668683. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Friday, July 26, 2024. This trademark is owned by KURARAY CO., LTD.. The PLANARION trademark is filed in the Cosmetics & Cleaning Products and Machinery Products categories with the following description:

Metalworking machines; Metalworking machine tools; Grinding machines for metalworking; Glassware manufacturing machines; Plastic processing machines; Semiconductor manufacturing machines; Rubber manufacturing machines; Metalworking polishing equipment; Semiconductor wafer processing machines; Semiconductor wafer planarization equipment; Polishing machines for use in grinding and polishing metal, wood, ceramics and plastics

Abrasive paper; Abrasive rolls; Abrasive sheets; Abrasive cloth; Sand for use as abrasive in sandblasting; Abrasive cleaning preparations; Cleaning, polishing, scouring and abrasive preparations; Polishing preparations; Stone polishing preparations; Polishing paper; General purpose cleaning, polishing, and abrasive liquids and powders; Industrial abrasives for use in semiconductor; Sandpaper; Grinding and polishing pads for manufacturing machines; polishing pads for semiconductors
planarion

General Information

Serial Number98668683
Word MarkPLANARION
Filing DateFriday, July 26, 2024
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateFriday, July 26, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements

Goods and ServicesMetalworking machines; Metalworking machine tools; Grinding machines for metalworking; Glassware manufacturing machines; Plastic processing machines; Semiconductor manufacturing machines; Rubber manufacturing machines; Metalworking polishing equipment; Semiconductor wafer processing machines; Semiconductor wafer planarization equipment; Polishing machines for use in grinding and polishing metal, wood, ceramics and plastics
Goods and ServicesAbrasive paper; Abrasive rolls; Abrasive sheets; Abrasive cloth; Sand for use as abrasive in sandblasting; Abrasive cleaning preparations; Cleaning, polishing, scouring and abrasive preparations; Polishing preparations; Stone polishing preparations; Polishing paper; General purpose cleaning, polishing, and abrasive liquids and powders; Industrial abrasives for use in semiconductor; Sandpaper; Grinding and polishing pads for manufacturing machines; polishing pads for semiconductors

Classification Information

International Class003 - Bleaching preparations and other substances for laundry use; cleaning, polishing, scouring and abrasive preparations; soaps; perfumery, essential oils, cosmetics, hair lotions; dentifrices.
US Class Codes001, 004, 006, 050, 051, 052
Class Status Code6 - Active
Class Status DateFriday, July 26, 2024
Primary Code003
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE
International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateFriday, July 26, 2024
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameKURARAY CO., LTD.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressOkayama Prefecture 710-0801
JP

Trademark Events

Event DateEvent Description
Friday, July 26, 2024NEW APPLICATION ENTERED

Related Keywords

planarion polishing machines abrasive semiconductor metalworking manufacturing preparations grinding cleaning wafer