PILLAR BUMP Trademark of Focus Interconnect Technology Corporation - Serial Number 76035876

Trademark Overview

On Thursday, April 27, 2000, a trademark application was filed for PILLAR BUMP with the United States Patent and Trademark Office. The USPTO has given the PILLAR BUMP trademark a serial number of 76035876. The federal status of this trademark filing is ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE as of Tuesday, February 5, 2002. This trademark is owned by Focus Interconnect Technology Corporation. The PILLAR BUMP trademark is filed in the Treatment & Processing of Materials Services category with the following description:

MANUFACTURING FOR OTHERS, NAMELY, ELECTROPLATING CONDUCTIVE MATERIAL ON INTEGRATED CIRCUITS AT THE WAFER LEVEL

General Information

Serial Number	76035876
Word Mark	PILLAR BUMP
Filing Date	Thursday, April 27, 2000
Status	602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE
Status Date	Tuesday, February 5, 2002
Registration Number	0000000
Registration Date	NOT AVAILABLE
Mark Drawing	1000 - Typeset: Word(s) / letter(s) / number(s)
Published for Opposition Date	NOT AVAILABLE

Trademark Statements

Goods and Services

MANUFACTURING FOR OTHERS, NAMELY, ELECTROPLATING CONDUCTIVE MATERIAL ON INTEGRATED CIRCUITS AT THE WAFER LEVEL

Classification Information

International Class	040 - Treatment of materials.
US Class Codes	100, 103, 106
Class Status Code	6 - Active
Class Status Date	Wednesday, July 12, 2000
Primary Code	040
First Use Anywhere Date	Tuesday, July 27, 1999
First Use In Commerce Date	Tuesday, July 27, 1999

Trademark Owner History

Party Name	Focus Interconnect Technology Corporation
Party Type	10 - Original Applicant
Legal Entity Type	03 - Corporation
Address	Austin, TX 78727

Trademark Events

Event Date	Event Description
Tuesday, February 5, 2002	ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE
Wednesday, February 28, 2001	CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, February 28, 2001	UNRESPONSIVE/DUPLICATE PAPER RECEIVED
Wednesday, February 28, 2001	CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, April 2, 2001	NON-FINAL ACTION MAILED
Friday, September 29, 2000	ASSIGNED TO EXAMINER

Related Keywords

bump pillar integrated circuits wafer level material conductive others namely electroplating manufacturing