| Serial Number | 99082749 |
| Word Mark | PCBL |
| Filing Date | Thursday, March 13, 2025 |
| Status | 686 - PUBLISHED FOR OPPOSITION |
| Status Date | Tuesday, March 3, 2026 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, March 3, 2026 |
| Goods and Services | Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin |
| Goods and Services | Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets for use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips |
| Goods and Services | semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors |
| Goods and Services | laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastic films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer |
| International Class | 001 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; unprocessed artificial resins; unprocessed plastics; manures; fire extinguishing compositions; tempering and soldering preparations; chemical substances for preserving foodstuffs; tanning substances; adhesives used in industry. |
| US Class Codes | 001, 005, 006, 010, 026, 046 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, March 13, 2025 |
| Primary Code | 001 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs. |
| US Class Codes | 013, 019, 021, 023, 024, 031, 034, 035 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, March 13, 2025 |
| Primary Code | 007 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal. |
| US Class Codes | 001, 005, 012, 013, 035, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, March 13, 2025 |
| Primary Code | 017 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, March 13, 2025 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | Lintec Kabushiki Kaisha |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 173-0001 JP |
| Party Name | Lintec Kabushiki Kaisha |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Tokyo 173-0001 JP |
| Event Date | Event Description |
| Thursday, March 13, 2025 | NEW APPLICATION ENTERED |
| Thursday, March 13, 2025 | APPLICATION FILING RECEIPT MAILED |
| Thursday, July 10, 2025 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Thursday, August 14, 2025 | ASSIGNED TO EXAMINER |
| Thursday, August 14, 2025 | EXAMINERS AMENDMENT -WRITTEN |
| Thursday, August 14, 2025 | EXAMINERS AMENDMENT E-MAILED |
| Thursday, August 14, 2025 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Thursday, August 14, 2025 | EXAMINER'S AMENDMENT ENTERED |
| Thursday, August 14, 2025 | SUSPENSION LETTER WRITTEN |
| Thursday, August 14, 2025 | LETTER OF SUSPENSION E-MAILED |
| Thursday, August 14, 2025 | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED |
| Tuesday, January 27, 2026 | TEAS RESPONSE TO SUSPENSION INQUIRY RECEIVED |
| Tuesday, February 3, 2026 | ASSIGNED TO LIE |
| Tuesday, February 3, 2026 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Tuesday, February 3, 2026 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Friday, February 6, 2026 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, February 25, 2026 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, March 3, 2026 | PUBLISHED FOR OPPOSITION |
| Tuesday, March 3, 2026 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |