Trademark Overview
On Thursday, March 13, 2025, a trademark application was filed for PCBL with the United States Patent and Trademark Office. The USPTO has given the PCBL trademark a serial number of 99082749. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Thursday, March 13, 2025. This trademark is owned by Lintec Kabushiki Kaisha. The PCBL trademark is filed in the Chemical Products, Machinery Products, Treatment & Processing of Materials Services, and Rubber Products categories with the following description:
laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastc films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer
semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors
Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets fo use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips
Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin