Trademark Overview
On Thursday, March 13, 2025, a trademark application was filed for PCBL with the United States Patent and Trademark Office. The USPTO has given the PCBL trademark a serial number of 99082749. The federal status of this trademark filing is SUSPENSION LETTER - MAILED as of Thursday, August 14, 2025. This trademark is owned by Lintec Kabushiki Kaisha. The PCBL trademark is filed in the Chemical Products, Machinery Products, Treatment & Processing of Materials Services, and Rubber Products categories with the following description:
laminating of adhesive tapes and self-adhesive tapes; peeling of adhesive tapes and self-adhesive tapes; treatment and processing of plastic films and sheets; treatment and processing of metal foil; treatment and processing of synthetic papers and other papers; molding and processing of silicones and other resins; resins coating of semiconductor or wafer; electric irradiation treatment of resins; treatment and processing of semiconductor or wafer; rental of semiconductor manufacturing machines and apparatus; Fluid resin dispensing of semiconductor or wafer
semiconductor manufacturing machines; electric irradiation apparatus for use in manufacture of semiconductors; apparatus for adhesion of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in the manufacture of semiconductors; peeling apparatus of protective tapes for semiconductor chip backs and protective tapes for semiconductor chip surfaces for use in manufacture of semiconductor; adhesion apparatus for use in manufacturing semicondoctors; Fluid resin dispensing machine for use in manufacturing semiconductors
Semi-worked synthetic plastic and synthetic resins as semi-finished products in form of films and sheets; Adhesive-coated plastic sheets for use in manufacture; adhesive tapes and self-adhesive tapes for use in the processing of semiconductor; adhesive tapes and self-adhesive tapes for use in the mounting of semiconductor; tapes for use in the peeling of tapes for semiconductor wafer processing; heat sensitive adhesive tapes for use in the manufacture of electronic parts; protective tapes for the rear surface of semiconductor chips
Adhesives for use in industry; Synthetic resin adhesives for industrial purposes; Adhesives for semiconductor processing; Adhesives for filling recesses in semiconductor wafers; Adhesives for adjusting the peripheral height of semiconductor wafers; self-adhesives for use in industry; unprocessed ultraviolet-curable polymer resins; Unprocessed synthetic resin