PANELMOLD Trademark

Trademark Overview

On Wednesday, July 10, 2013, a trademark application was filed for PANELMOLD with the United States Patent and Trademark Office. The USPTO has given the PANELMOLD trademark a serial number of 86006708. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Wednesday, October 1, 2025. This trademark is owned by Towa Corporation. The PANELMOLD trademark is filed in the Machinery Products category with the following description:

Machines for encapsulation of semiconductor chips mounted on substrates with resin material
panelmold

General Information

Serial Number86006708
Word MarkPANELMOLD
Filing DateWednesday, July 10, 2013
Status710 - CANCELLED - SECTION 8
Status DateWednesday, October 1, 2025
Registration Number4661819
Registration DateTuesday, December 30, 2014
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, April 29, 2014

Trademark Statements

Goods and ServicesMachines for encapsulation of semiconductor chips mounted on substrates with resin material
Pseudo MarkPANEL MOLD

Classification Information

International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateWednesday, October 1, 2025
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History

Party NameTowa Corporation
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressKyoto-shi, Kyoto 601-8105
JP
Party NameTowa Corporation
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressKyoto
JP
Party NameTowa Corporation
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressKyoto
JP

Trademark Events

Event DateEvent Description
Friday, July 19, 2013NOTICE OF PSEUDO MARK E-MAILED
Tuesday, October 22, 2013ASSIGNED TO EXAMINER
Saturday, July 13, 2013NEW APPLICATION ENTERED
Thursday, July 18, 2013NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Wednesday, March 12, 2014ASSIGNED TO LIE
Wednesday, March 19, 2014CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, March 19, 2014TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, April 9, 2014NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, April 29, 2014TEAS CHANGE OF CORRESPONDENCE RECEIVED
Tuesday, April 29, 2014PUBLISHED FOR OPPOSITION
Tuesday, April 29, 2014OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, June 24, 2014NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, October 22, 2013NON-FINAL ACTION WRITTEN
Tuesday, October 22, 2013NON-FINAL ACTION E-MAILED
Tuesday, October 22, 2013NOTIFICATION OF NON-FINAL ACTION E-MAILED
Thursday, February 27, 2014TEAS RESPONSE TO OFFICE ACTION RECEIVED
Thursday, March 20, 2014APPROVED FOR PUB - PRINCIPAL REGISTER
Thursday, March 27, 2014LAW OFFICE PUBLICATION REVIEW COMPLETED
Tuesday, December 30, 2014REGISTERED-PRINCIPAL REGISTER
Monday, December 30, 2019COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
Friday, August 28, 2020TEAS SECTION 8 & 15 RECEIVED
Thursday, September 11, 2014TEAS DELETE 1(B) BASIS RECEIVED
Thursday, September 11, 2014NOTICE OF ALLOWANCE CANCELLED
Thursday, September 18, 20141(B) BASIS DELETED; PROCEED TO REGISTRATION
Wednesday, September 17, 2014CASE ASSIGNED TO INTENT TO USE PARALEGAL
Saturday, December 30, 2023COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Monday, February 10, 2025CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Friday, March 7, 2025POST REGISTRATION ACTION MAILED - SEC. 8 & 9
Wednesday, October 1, 2025CANCELLED SEC. 8 (10-YR)
Wednesday, October 1, 2025NOTICE OF CANCELLATION SEC. 8 EMAILED
Saturday, October 10, 2020CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Saturday, October 10, 2020REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Saturday, October 10, 2020NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
Wednesday, October 16, 2024TEAS SECTION 8 & 9 RECEIVED

Related Keywords

panelmold substrates resin material mounted chips encapsulation semiconductor machines