| Serial Number | 79358894 |
| Word Mark | NOVASIC |
| Filing Date | Tuesday, September 27, 2022 |
| Status | 700 - REGISTERED |
| Status Date | Tuesday, May 28, 2024 |
| Registration Number | 7394032 |
| Registration Date | Tuesday, May 28, 2024 |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, March 12, 2024 |
| Goods and Services | mechanical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to machining operations, namely, processing for conducting cuts, meplats, bevels; mechanical, chemical and optical treatment of wafers of semiconductor or piezoelectric materials or oxides relating to for surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; other mechanical, chemical and physical surface treatments, , used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; surface characterization process being, physical, chemical and optical, namely, topography, roughness and chemical analysis; structure characterization method being chemical or physical, namely, morphology and crystal structure; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling |
| Goods and Services | Single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different machining operations, namely, operations for conducting cuts, meplats, bevels; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface preparation operations ready for epitaxy or bonding, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; single-layer or multilayer wafers of semiconductor or piezoelectric materials or oxides having received different surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components; all these goods being used in precision grinding, mechanical and chemical mechanical polishing (CMP) operations and other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling |
| Goods and Services | Testing of machining techniques, namely, technical tests and trials for conducting cuts, meplats, bevels; testing and tests of surface preparation techniques, namely, technical testing and testing of lapping, precision grinding, mechanical and chemical mechanical polishing (CMP), cleaning, laser marking; technical tests of other surface treatments for others in the field of materials used to for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; research and development for new products for others; research and development of new consumable products for others used in machining operations, namely, operations for conducting cuts, meplats, bevels; research and development of new consumable products for others for use in surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; research and development of new consumables for others used in other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for conducting machining operations, namely, operations for conducting cuts, meplats, bevels; technical advice for conducting surface preparation operations, namely, lapping, precision grinding, mechanical and chemical mechanical (CMP) polishing, cleaning, laser marking operations; technical advice for conducting other surface treatments in the field of materials used for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding or for wafer recycling; technical advice for surface characterization, namely, topography, roughness and chemical analysis; technical advice for structure characterization, namely, morphology and crystallography; all these services being provided in the field of semiconductor or piezoelectric materials or oxides for obtaining electronic or opto-electronic or photonic components or for layer growth by epitaxy or for molecular bonding |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, January 3, 2023 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 023, 026, 036, 038 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, January 3, 2023 |
| Primary Code | 009 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
| US Class Codes | 100, 101 |
| Class Status Code | 6 - Active |
| Class Status Date | Tuesday, January 3, 2023 |
| Primary Code | 042 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | NOVASIC |
| Party Type | 30 - Original Registrant |
| Legal Entity Type | 34 - NOT AVAILABLE |
| Address | FR |
| Party Name | NOVASIC |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 34 - NOT AVAILABLE |
| Address | FR |
| Party Name | NOVASIC |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 34 - NOT AVAILABLE |
| Address | FR |
| Event Date | Event Description |
| Wednesday, July 26, 2023 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Friday, December 30, 2022 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Tuesday, January 3, 2023 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Saturday, January 7, 2023 | APPLICATION FILING RECEIPT MAILED |
| Wednesday, July 12, 2023 | ASSIGNED TO EXAMINER |
| Tuesday, July 25, 2023 | NON-FINAL ACTION WRITTEN |
| Saturday, August 19, 2023 | REFUSAL PROCESSED BY MPU |
| Saturday, August 19, 2023 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Wednesday, September 13, 2023 | REFUSAL PROCESSED BY IB |
| Thursday, January 18, 2024 | TEAS CHANGE OF OWNER ADDRESS RECEIVED |
| Thursday, January 18, 2024 | APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED |
| Thursday, January 18, 2024 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| Thursday, January 18, 2024 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| Thursday, January 18, 2024 | TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS |
| Tuesday, February 6, 2024 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Thursday, January 18, 2024 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| Tuesday, February 6, 2024 | EXAMINERS AMENDMENT -WRITTEN |
| Tuesday, February 6, 2024 | EXAMINERS AMENDMENT E-MAILED |
| Tuesday, February 6, 2024 | EXAMINER'S AMENDMENT ENTERED |
| Tuesday, February 6, 2024 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, February 21, 2024 | NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB |
| Wednesday, February 21, 2024 | NOTICE OF START OF OPPOSITION PERIOD CREATED, TO BE SENT TO IB |
| Wednesday, February 21, 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Wednesday, February 21, 2024 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, March 12, 2024 | PUBLISHED FOR OPPOSITION |
| Tuesday, March 12, 2024 | NOTIFICATION PROCESSED BY IB |
| Thursday, April 11, 2024 | TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS |
| Tuesday, March 12, 2024 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Thursday, April 11, 2024 | ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED |
| Thursday, April 11, 2024 | TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED |
| Thursday, April 11, 2024 | TEAS CHANGE OF CORRESPONDENCE RECEIVED |
| Tuesday, May 28, 2024 | REGISTERED-PRINCIPAL REGISTER |
| Tuesday, May 28, 2024 | NOTICE OF REGISTRATION CONFIRMATION EMAILED |