NEXWAFE Trademark

Trademark Overview


On Monday, January 23, 2023, a trademark application was filed for NEXWAFE with the United States Patent and Trademark Office. The USPTO has given the NEXWAFE trademark a serial number of 79363887. The federal status of this trademark filing is PUBLISHED FOR OPPOSITION as of Tuesday, October 15, 2024. This trademark is owned by NexWafe GmbH. The NEXWAFE trademark is filed in the Machinery Products, Treatment & Processing of Materials Services, and Computer & Software Products & Electrical & Scientific Products categories with the following description:

Treatment and transformation of materials, namely, treatment of metal, treatment of semimetals, treatment of glass and treatment of ceramics; manufacturing of single crystals; Treatment and transformation of materials, namely, recycling, coating and surface treatment; Treatment and transformation of materials, namely, etching, printing, mill working, metal coating, casting, laser treatment, magnetization, burnishing services, sawing, grinding, blacksmithing, custom tailoring, stamping using a press and laminating of semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers, photovoltaic cells; contract manufacturing services in the field of semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells; Production of energy, thermal heat and electricity

Apparatus and instruments for conducting, switching, accumulating, regulating or controlling electricity; Apparatus and instruments for physics, namely chemical vapor deposition chambers and parts and accessories thereof for epitaxy and for crystalline growth of semiconductor heterostructures; Apparatus and instruments, namely, laser apparatus, saws and grinders and parts and accessories thereof for cutting and grinding of semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers and photovoltaic cells; Apparatus and instruments, namely, automation handling equipment for gripping, separating, detaching, placing and moving of semiconductor wafers, semiconductor layer stacks, semiconductor chips, photovoltaic wafers and photovoltaic cells; chemistry apparatus and instruments, namely wet benches, dry etching chambers, gas controlled ovens and furnaces and parts and accessories thereof for wet and dry chemical etching, annealing and dopi...

Machines for machining metals, semimetals and ceramics; industrial robots; machines for electrical engineering industries and electrical industries for drying and plating, namely electro and electroless depositions processing of different substrates, particularly semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells; machines for chemical industry, material processing industries, mining industry and power generation industry for installations for wet and dry chemical etching and annealing, wet-chemical cleaning processing of different substrates, particularly semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells, and machines for epitaxy and for the crystalline growth of semiconductor heterostructures, and machines for cutting, grinding, separating or handling; Machine tools, namely, tools for producing semiconductor wafers, semiconduct...
nexwafe

General Information


Serial Number79363887
Word MarkNEXWAFE
Filing DateMonday, January 23, 2023
Status686 - PUBLISHED FOR OPPOSITION
Status DateTuesday, October 15, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, October 15, 2024

Trademark Statements


Goods and ServicesTreatment and transformation of materials, namely, treatment of metal, treatment of semimetals, treatment of glass and treatment of ceramics; manufacturing of single crystals; Treatment and transformation of materials, namely, recycling, coating and surface treatment; Treatment and transformation of materials, namely, etching, printing, mill working, metal coating, casting, laser treatment, magnetization, burnishing services, sawing, grinding, blacksmithing, custom tailoring, stamping using a press and laminating of semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers, photovoltaic cells; contract manufacturing services in the field of semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells; Production of energy, thermal heat and electricity
Goods and ServicesApparatus and instruments for conducting, switching, accumulating, regulating or controlling electricity; Apparatus and instruments for physics, namely chemical vapor deposition chambers and parts and accessories thereof for epitaxy and for crystalline growth of semiconductor heterostructures; Apparatus and instruments, namely, laser apparatus, saws and grinders and parts and accessories thereof for cutting and grinding of semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers and photovoltaic cells; Apparatus and instruments, namely, automation handling equipment for gripping, separating, detaching, placing and moving of semiconductor wafers, semiconductor layer stacks, semiconductor chips, photovoltaic wafers and photovoltaic cells; chemistry apparatus and instruments, namely wet benches, dry etching chambers, gas controlled ovens and furnaces and parts and accessories thereof for wet and dry chemical etching, annealing and doping of semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers and photovoltaic cells; material testing instruments and machines, namely, electronic apparatus for testing of semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells; data processing equipment and computers; microprocessors; Integrated circuit chips for the manufacture of semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers, photovoltaic cells; electric and electronic components, namely, semiconductors; silicon wafers and semiconductor wafers for integrated circuits; parts of all the aforesaid goods in this class.
Goods and ServicesMachines for machining metals, semimetals and ceramics; industrial robots; machines for electrical engineering industries and electrical industries for drying and plating, namely electro and electroless depositions processing of different substrates, particularly semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells; machines for chemical industry, material processing industries, mining industry and power generation industry for installations for wet and dry chemical etching and annealing, wet-chemical cleaning processing of different substrates, particularly semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells, and machines for epitaxy and for the crystalline growth of semiconductor heterostructures, and machines for cutting, grinding, separating or handling; Machine tools, namely, tools for producing semiconductor wafers, semiconductor layer stacks, semi-conductor chips, medical implants, photovoltaic wafers, photovoltaic cells; control mechanisms for machines, namely sensors, valves, locks, switches and actuators for fluids, moving parts and workpieces in wet chemical etching, for gases, current, moving parts and workpieces in machines for epitaxy and for lasers, moving parts and workpieces in machines for cutting, grinding, separating or handling semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers, photovoltaic cells; Structural parts of machines used for wet and dry chemical etching and annealing, epitaxy and machines for the crystalline growth of semiconductor heterostructures, and for cutting, grinding, separating or handling of semiconductor wafers, semiconductor layer stacks, semiconductor chips, medical implants, photovoltaic wafers, photovoltaic cells

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 024, 031, 034, 035
Class Status Code6 - Active
Class Status DateMonday, February 27, 2023
Primary Code007
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateMonday, February 27, 2023
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateMonday, February 27, 2023
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameNexWafe GmbH
Party Type20 - Owner at Publication
Legal Entity Type16 - Limited Liability Company
AddressDE

Party NameNexWafe GmbH
Party Type10 - Original Applicant
Legal Entity Type16 - Limited Liability Company
AddressDE

Trademark Events


Event DateEvent Description
Tuesday, November 14, 2023REFUSAL PROCESSED BY MPU
Friday, February 24, 2023SN ASSIGNED FOR SECT 66A SUBSEQ DESIG FROM IB
Monday, February 27, 2023NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Friday, March 3, 2023APPLICATION FILING RECEIPT MAILED
Friday, October 20, 2023ASSIGNED TO EXAMINER
Thursday, November 9, 2023NON-FINAL ACTION WRITTEN
Friday, November 10, 2023NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW
Monday, December 18, 2023REFUSAL PROCESSED BY IB
Monday, May 13, 2024CORRESPONDENCE RECEIVED IN LAW OFFICE
Tuesday, November 14, 2023NON-FINAL ACTION MAILED - REFUSAL SENT TO IB
Monday, May 13, 2024TEAS RESPONSE TO OFFICE ACTION RECEIVED
Tuesday, May 14, 2024TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, May 16, 2024ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Thursday, May 16, 2024TEAS CHANGE OF DOMESTIC REPRESENTATIVES ADDRESS
Thursday, May 16, 2024TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED
Thursday, May 16, 2024TEAS CHANGE OF CORRESPONDENCE RECEIVED
Monday, June 3, 2024FINAL REFUSAL WRITTEN
Monday, June 3, 2024NOTIFICATION OF FINAL REFUSAL EMAILED
Monday, June 3, 2024FINAL REFUSAL E-MAILED
Friday, June 21, 2024EXAMINERS AMENDMENT -WRITTEN
Wednesday, June 26, 2024PREVIOUS ALLOWANCE COUNT WITHDRAWN
Wednesday, June 26, 2024EXAMINER'S AMENDMENT ENTERED
Wednesday, June 26, 2024NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Wednesday, June 26, 2024APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, June 26, 2024EXAMINERS AMENDMENT E-MAILED
Friday, June 21, 2024EXAMINER'S AMENDMENT ENTERED
Friday, June 21, 2024EXAMINERS AMENDMENT E-MAILED
Friday, June 21, 2024APPROVED FOR PUB - PRINCIPAL REGISTER
Friday, June 21, 2024NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Wednesday, June 26, 2024WITHDRAWN FROM PUB - SENIOR ATTORNEY REQUEST
Wednesday, June 26, 2024EXAMINERS AMENDMENT -WRITTEN
Saturday, August 10, 2024NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB
Wednesday, September 25, 2024NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Tuesday, October 15, 2024PUBLISHED FOR OPPOSITION
Tuesday, October 15, 2024OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Monday, July 22, 2024NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB
Sunday, July 21, 2024NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB