| Serial Number | 77084719 |
| Word Mark | NEXTREME THERMAL SOLUTIONS |
| Filing Date | Wednesday, January 17, 2007 |
| Status | 602 - ABANDONED - FAILURE TO RESPOND OR LATE RESPONSE |
| Status Date | Tuesday, September 6, 2011 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 5000 - Drawing with word(s) / letter(s) / number(s) in Stylized form |
| Published for Opposition Date | NOT AVAILABLE |
| Indication of Colors claimed | The applicant claims color as a feature of the mark, namely, red and blue. |
| Disclaimer with Predetermined Text | "Thermal Solutions" |
| Description of Mark | The mark consists of the words "Nextreme Thermal Solutions" with the letters NE and the upper portion of the X appearing in red; the lower portion of the X and the letters TREME appearing in blue, and the words "Thermal Solutions" appearing in red. |
| Goods and Services | Thermal management components and modules, namely conventional thermoelectric modules; thin-film thermoelectric coolers and thermally active copper pillar bumps containing a thin film thermoelectric nanomaterial, for applications in the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal power generation and energy harvesting components and modules, namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, for applications in the semiconductor, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; thermal management components and modules, namely thin-film thermoelectric device namely, thermoelectric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical biomedical, bio-tech, defense aerospace, and automotive industries; and thermal power generation and energy and harvesting components and modules, namely, thermo electric coolers and thermally active copper pillar bumps containing a thin-film thermoelectric nanomaterial, and conventional thermoelectric device namely, conventional thermoelectric modules, for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries |
| Goods and Services | Custom manufacturing for others in the field of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive |
| Goods and Services | Providing thermal management solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries; and providing thermal power generation and energy harvesting solutions, namely design, development and testing of thermal management components and modules, namely thin-film thermoelectric devices and conventional thermoelectric devices for applications in the instrumentation, testing and measurement for the semiconductor, computer and consumer electronics, optics, photonics, opto-electronics, microfluidics, medical, bio-medical, bio-tech, defense, aerospace, and automotive industries |
| Pseudo Mark | NEXT EXTREME THERMAL SOLUTIONS |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 023, 026, 036, 038 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, January 22, 2007 |
| Primary Code | 009 |
| First Use Anywhere Date | Monday, January 31, 2005 |
| First Use In Commerce Date | Monday, January 31, 2005 |
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, November 22, 2007 |
| Primary Code | 040 |
| First Use Anywhere Date | Monday, January 31, 2005 |
| First Use In Commerce Date | Monday, January 31, 2005 |
| International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
| US Class Codes | 100, 101 |
| Class Status Code | 6 - Active |
| Class Status Date | Monday, January 22, 2007 |
| Primary Code | 042 |
| First Use Anywhere Date | Monday, January 31, 2005 |
| First Use In Commerce Date | Monday, January 31, 2005 |
| Party Name | Nextreme Thermal Solutions, Inc. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Research Triangle Park, NC 27709 |
| Event Date | Event Description |
| Tuesday, September 6, 2011 | ABANDONMENT NOTICE MAILED - FAILURE TO RESPOND |
| Tuesday, September 6, 2011 | ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE |
| Tuesday, February 8, 2011 | NOTIFICATION OF NON-FINAL ACTION E-MAILED |
| Tuesday, February 8, 2011 | NON-FINAL ACTION E-MAILED |
| Tuesday, February 8, 2011 | NON-FINAL ACTION WRITTEN |
| Wednesday, January 19, 2011 | LIE CHECKED SUSP - TO ATTY FOR ACTION |
| Monday, July 19, 2010 | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED |
| Thursday, July 8, 2010 | ASSIGNED TO EXAMINER |
| Tuesday, January 19, 2010 | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED |
| Wednesday, July 15, 2009 | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED |
| Thursday, January 15, 2009 | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED |
| Wednesday, July 9, 2008 | REPORT COMPLETED SUSPENSION CHECK CASE STILL SUSPENDED |
| Wednesday, July 9, 2008 | ASSIGNED TO LIE |
| Friday, February 15, 2008 | ASSIGNED TO EXAMINER |
| Wednesday, January 9, 2008 | NOTIFICATION OF LETTER OF SUSPENSION E-MAILED |
| Wednesday, January 9, 2008 | LETTER OF SUSPENSION E-MAILED |
| Wednesday, January 9, 2008 | SUSPENSION LETTER WRITTEN |
| Thursday, November 22, 2007 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Wednesday, November 21, 2007 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Wednesday, November 21, 2007 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Tuesday, May 22, 2007 | NON-FINAL ACTION E-MAILED |
| Tuesday, May 22, 2007 | NON-FINAL ACTION WRITTEN |
| Sunday, May 6, 2007 | ASSIGNED TO EXAMINER |
| Tuesday, January 23, 2007 | NOTICE OF PSEUDO MARK MAILED |
| Monday, January 22, 2007 | NEW APPLICATION ENTERED IN TRAM |