Trademark Overview
On Monday, July 17, 2023, a trademark application was filed for MULTI-DIE-INTEGRATION ALLIANCE with the United States Patent and Trademark Office. The USPTO has given the MULTI-DIE-INTEGRATION ALLIANCE trademark a serial number of 98088753. The federal status of this trademark filing is REGISTERED as of Tuesday, October 22, 2024. This trademark is owned by Samsung Electronics Co., Ltd.. The MULTI-DIE-INTEGRATION ALLIANCE trademark is filed in the Treatment & Processing of Materials Services, Computer & Software Services & Scientific Services, and Computer & Software Products & Electrical & Scientific Products categories with the following description:
Semiconductor foundry services being metal casting for semiconductors; semiconductor foundry services being the custom
manufacture of semiconductor wafers; processing of semiconductors being the custom manufacture of semiconductors; custom
manufacturing and assembling services relating to semi-conductor parts and integrated circuits; semiconductor and integrated
circuit foundry services, namely, custom manufacture of semiconductors and integrated circuits; custom manufacturing services in
the nature of processing of integrated circuits being the custom manufacture of integrated circuits; custom manufacturing services
in the nature of processing of semiconductor elements being the custom manufacture of semiconductor components; custom
manufacturing services in the nature of processing of semiconductor wafers being the custom manufacture of semiconductor
wafers; custom manufacture of semiconductor wafers; processing of semiconductor equipment and parts being the custom
manufacture of sem...
Semiconductors; optical semiconductors; semiconductor devices; semiconductor component, namely, chips and lead frames; semiconductor components, namely, transistors and diodes; semiconductor component, namely, semiconductor chips; semiconductor components, namely, luminous element packages; semiconductor elements, namely, chips and lead frames; semiconductor elements, namely, wafers, chips, substrates, optical amplifiers, testing apparatus, power elements, chip housings; semiconductor wafers; electronic semiconductors; integrated circuits; chips, namely, integrated circuits; wafers for integrated circuits; solid state drives; semiconductor memories
Design of semiconductors; design of semiconductors and integrated circuits; product research, custom design and testing for new
product development in the field of semiconductors; technical research in the field of semiconductor design; technical research in
the field of semiconductor manufacturing; design of semiconductor chips; quality control services by tracking of semiconductor
devices
