LICOP Trademark

Trademark Overview


On Tuesday, October 4, 2005, a trademark application was filed for LICOP with the United States Patent and Trademark Office. The USPTO has given the LICOP trademark a serial number of 78726132. The federal status of this trademark filing is CANCELLED - SECTION 8 as of Friday, May 3, 2019. This trademark is owned by NGK Spark Plug Co., Ltd.. The LICOP trademark is filed in the Computer & Software Products & Electrical & Scientific Products category with the following description:

Integrated circuit packages for semi-conductors, namely, semiconductor chip housings; semiconductor chip packages containing semiconductor chip housings and semiconductor chips; packages for crystal resonator or SAW, Surface Acoustic Wave, filter, namely, protective housings for crystal resonator or SAW Surface Acoustic Wave, filter; leadless chip carriers, namely semiconductor chip housings; semiconductor devices, namely interposers for semiconductors, namely, connectors for semiconductors; printed wiring boards for semi-conductors; integrated circuit packages for semi-conductors, namely, pin grid array chip packages consisting of supporting boards on which pins are gridded array; integrated circuit packages for semi-conductors, namely, ball grid array chip packages consisting of supporting boards on which balls are gridded array; integrated circuit packages for semi-conductors, namely, flat packages consisting of housings for integrated circuits; integrated circuit packages for semi-...
licop

General Information


Serial Number78726132
Word MarkLICOP
Filing DateTuesday, October 4, 2005
Status710 - CANCELLED - SECTION 8
Status DateFriday, May 3, 2019
Registration Number3509964
Registration DateTuesday, September 30, 2008
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, November 14, 2006

Trademark Statements


Goods and ServicesIntegrated circuit packages for semi-conductors, namely, semiconductor chip housings; semiconductor chip packages containing semiconductor chip housings and semiconductor chips; packages for crystal resonator or SAW, Surface Acoustic Wave, filter, namely, protective housings for crystal resonator or SAW Surface Acoustic Wave, filter; leadless chip carriers, namely semiconductor chip housings; semiconductor devices, namely interposers for semiconductors, namely, connectors for semiconductors; printed wiring boards for semi-conductors; integrated circuit packages for semi-conductors, namely, pin grid array chip packages consisting of supporting boards on which pins are gridded array; integrated circuit packages for semi-conductors, namely, ball grid array chip packages consisting of supporting boards on which balls are gridded array; integrated circuit packages for semi-conductors, namely, flat packages consisting of housings for integrated circuits; integrated circuit packages for semi-conductors, namely, packages consisting of supporting boards and housings for integrated circuits for high frequency band; aluminum nitride products, namely, ceramic integrated circuit packages consisting of ceramic housings and supporting boards used in the manufacture of CPUs, Central Processing Units, or MPUs, Micro Processor Units; integrated circuit packages for semi-conductors, namely, ceramic packages consisting of ceramic housings and supporting boards used in the manufacture of CPUs, Central Processing Units, or MPUs, Micro Processor Units; electric wires, namely printed wiring; printed circuit boards, namely, multilayer circuit boards; substrates for semi-conductors, namely, supporting boards on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached or in which electronic devices including integrated circuits, chip condensers and chip capacitors are embedded; polyimide thin film multilayer substrates for semi-conductors, namely, supporting material on which electronic devices including integrated circuits, chip condensers and chip capacitors are attached; multi-chip module substrates, namely, supporting boards on which integrated circuits, chip condensers, chip capacitors, chip resistors and chip inductors are installed; glazed substrates for thermal printer heads, namely, supporting boards which are attached in thermal printer heads

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code2 - Sec. 8 - Entire Registration
Class Status DateFriday, May 3, 2019
Primary Code009
First Use Anywhere DateMonday, July 14, 2008
First Use In Commerce DateMonday, July 14, 2008

Trademark Owner History


Party NameNGK Spark Plug Co., Ltd.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressNagoya City
JP

Party NameNGK Spark Plug Co., Ltd.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressNagoya City
JP

Party NameNGK Spark Plug Co., Ltd.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressNagoya City
JP

Trademark Events


Event DateEvent Description
Friday, May 3, 2019CANCELLED SEC. 8 (10-YR)/EXPIRED SECTION 9
Saturday, September 30, 2017COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Saturday, August 9, 2014NOTICE OF ACCEPTANCE OF SEC. 8 & 15 - E-MAILED
Saturday, August 9, 2014REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Saturday, August 9, 2014CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Wednesday, July 23, 2014TEAS SECTION 8 & 15 RECEIVED
Tuesday, September 30, 2008REGISTERED-PRINCIPAL REGISTER
Friday, August 22, 2008LAW OFFICE REGISTRATION REVIEW COMPLETED
Friday, August 22, 2008ASSIGNED TO LIE
Friday, August 15, 2008ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Friday, August 15, 2008STATEMENT OF USE PROCESSING COMPLETE
Friday, August 1, 2008USE AMENDMENT FILED
Friday, August 15, 2008CASE ASSIGNED TO INTENT TO USE PARALEGAL
Friday, August 1, 2008TEAS STATEMENT OF USE RECEIVED
Tuesday, January 22, 2008EXTENSION 2 GRANTED
Tuesday, January 22, 2008EXTENSION 2 FILED
Tuesday, January 22, 2008TEAS EXTENSION RECEIVED
Tuesday, January 8, 2008ASSIGNED TO EXAMINER
Thursday, July 5, 2007EXTENSION 1 GRANTED
Thursday, July 5, 2007EXTENSION 1 FILED
Thursday, July 5, 2007TEAS EXTENSION RECEIVED
Tuesday, February 6, 2007NOA MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, November 14, 2006PUBLISHED FOR OPPOSITION
Wednesday, October 25, 2006NOTICE OF PUBLICATION
Sunday, September 24, 2006LAW OFFICE PUBLICATION REVIEW COMPLETED
Friday, September 15, 2006ASSIGNED TO LIE
Wednesday, September 13, 2006APPROVED FOR PUB - PRINCIPAL REGISTER
Friday, September 8, 2006TEAS/EMAIL CORRESPONDENCE ENTERED
Thursday, September 7, 2006CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, September 7, 2006TEAS RESPONSE TO OFFICE ACTION RECEIVED
Friday, August 18, 2006PRIORITY ACTION MAILED
Thursday, August 17, 2006PRIORITY ACTION WRITTEN
Thursday, July 27, 2006AMENDMENT FROM APPLICANT ENTERED
Monday, July 10, 2006CORRESPONDENCE RECEIVED IN LAW OFFICE
Monday, July 10, 2006PAPER RECEIVED
Friday, May 5, 2006ASSIGNED TO EXAMINER
Wednesday, April 12, 2006NON-FINAL ACTION MAILED
Wednesday, April 12, 2006NON-FINAL ACTION WRITTEN
Thursday, April 6, 2006ASSIGNED TO EXAMINER
Friday, October 7, 2005NEW APPLICATION ENTERED IN TRAM