LEADING THE PACK Trademark
Trademark Overview
On Tuesday, December 1, 2020, a trademark application was filed for LEADING THE PACK with the United States Patent and Trademark Office. The USPTO has given the LEADING THE PACK trademark a serial number of 90352190. The federal status of this trademark filing is ABANDONED - NO STATEMENT OF USE FILED as of Monday, August 5, 2024. This trademark is owned by Cree, Inc.. The LEADING THE PACK trademark is filed in the Treatment & Processing of Materials Services, Computer & Software Products & Electrical & Scientific Products, and Computer & Software Services & Scientific Services categories with the following description:
Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices
Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches, and power modules
Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwid...
General Information
| Serial Number | 90352190 |
| Word Mark | LEADING THE PACK |
| Filing Date | Tuesday, December 1, 2020 |
| Status | 606 - ABANDONED - NO STATEMENT OF USE FILED |
| Status Date | Monday, August 5, 2024 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, May 4, 2021 |
Trademark Statements
| Goods and Services | Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices |
| Goods and Services | Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches, and power modules |
| Goods and Services | Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices |
Classification Information
| International Class | 040 - Treatment of materials. |
| US Class Codes | 100, 103, 106 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, February 5, 2021 |
| Primary Code | 040 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus. |
| US Class Codes | 021, 023, 026, 036, 038 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, February 5, 2021 |
| Primary Code | 009 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| International Class | 042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software. |
| US Class Codes | 100, 101 |
| Class Status Code | 6 - Active |
| Class Status Date | Friday, February 5, 2021 |
| Primary Code | 042 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
Trademark Owner History
| Party Name | WOLFSPEED, INC. |
| Party Type | 21 - New Owner After Publication |
| Legal Entity Type | 03 - Corporation |
| Address | DURHAM, NC 27703 |
| Party Name | Cree, Inc. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | Durham, NC 27703 |
| Party Name | Cree, Inc. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | Durham, NC 27703 |
Trademark Events
| Event Date | Event Description |
| Friday, December 4, 2020 | NEW APPLICATION ENTERED |
| Friday, February 5, 2021 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Saturday, March 20, 2021 | ASSIGNED TO EXAMINER |
| Tuesday, March 23, 2021 | EXAMINERS AMENDMENT -WRITTEN |
| Tuesday, March 23, 2021 | EXAMINERS AMENDMENT E-MAILED |
| Tuesday, March 23, 2021 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Tuesday, March 23, 2021 | EXAMINER'S AMENDMENT ENTERED |
| Friday, March 26, 2021 | EXAMINERS AMENDMENT -WRITTEN |
| Friday, March 26, 2021 | EXAMINERS AMENDMENT E-MAILED |
| Friday, March 26, 2021 | NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED |
| Friday, March 26, 2021 | EXAMINER'S AMENDMENT ENTERED |
| Friday, March 26, 2021 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, April 14, 2021 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, May 4, 2021 | PUBLISHED FOR OPPOSITION |
| Tuesday, May 4, 2021 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
| Tuesday, June 29, 2021 | NOA E-MAILED - SOU REQUIRED FROM APPLICANT |
| Wednesday, October 27, 2021 | AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP |
| Monday, December 20, 2021 | SOU TEAS EXTENSION RECEIVED |
| Monday, December 20, 2021 | SOU EXTENSION 1 FILED |
| Monday, December 20, 2021 | SOU EXTENSION 1 GRANTED |
| Wednesday, December 22, 2021 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Wednesday, June 29, 2022 | SOU TEAS EXTENSION RECEIVED |
| Wednesday, June 29, 2022 | SOU EXTENSION 2 FILED |
| Wednesday, June 29, 2022 | SOU EXTENSION 2 GRANTED |
| Friday, July 1, 2022 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Friday, December 23, 2022 | SOU TEAS EXTENSION RECEIVED |
| Friday, December 23, 2022 | SOU EXTENSION 3 FILED |
| Friday, December 23, 2022 | SOU EXTENSION 3 GRANTED |
| Tuesday, December 27, 2022 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Friday, June 23, 2023 | SOU TEAS EXTENSION RECEIVED |
| Friday, June 23, 2023 | SOU EXTENSION 4 FILED |
| Friday, June 23, 2023 | SOU EXTENSION 4 GRANTED |
| Tuesday, June 27, 2023 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Thursday, December 28, 2023 | SOU TEAS EXTENSION RECEIVED |
| Thursday, December 28, 2023 | SOU EXTENSION 5 FILED |
| Tuesday, January 16, 2024 | CASE ASSIGNED TO INTENT TO USE PARALEGAL |
| Thursday, January 18, 2024 | SOU EXTENSION 5 GRANTED |
| Friday, January 19, 2024 | NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED |
| Monday, August 5, 2024 | ABANDONMENT - NO USE STATEMENT FILED |
| Monday, August 5, 2024 | ABANDONMENT NOTICE E-MAILED - NO USE STATEMENT FILED |
