LEADING THE PACK Trademark

Trademark Overview


On Tuesday, December 1, 2020, a trademark application was filed for LEADING THE PACK with the United States Patent and Trademark Office. The USPTO has given the LEADING THE PACK trademark a serial number of 90352190. The federal status of this trademark filing is FIFTH EXTENSION - GRANTED as of Thursday, January 18, 2024. This trademark is owned by Cree, Inc.. The LEADING THE PACK trademark is filed in the Computer & Software Products & Electrical & Scientific Products, Treatment & Processing of Materials Services, and Computer & Software Services & Scientific Services categories with the following description:

Customized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices

Integrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches, and power modules

Testing of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwid...
leading the pack

General Information


Serial Number90352190
Word MarkLEADING THE PACK
Filing DateTuesday, December 1, 2020
Status734 - FIFTH EXTENSION - GRANTED
Status DateThursday, January 18, 2024
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, May 4, 2021

Trademark Statements


Goods and ServicesCustomized materials assembly for others; manufacture of radio frequency in microwave devices and components, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others; manufacture of transistors for others; manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of lateral diffused metal oxide semiconductors (LDMOS) for others; manufacture of metal semiconductor field effect transistors (MESFETS) for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; manufacturing services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices
Goods and ServicesIntegrated circuit chips; microwave generating devices for industrial use, namely, microwave integrated circuits; transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon semiconductor wafers, silicon carbide semiconductor wafers, and gallium nitride semiconductor wafers; radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, semiconductor devices in the nature of MMIC bare die, discrete broadband die, and discrete bare die; power transistor switching devices; power supplies; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, electric circuit switches, and power modules
Goods and ServicesTesting of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; technical project research of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; research and development of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and gallium nitride power and wireless systems; design of radio frequency and microwave devices and components in the nature of packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, MMIC bare die, discrete broadband die, discrete bare die for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), metal semiconductor field effect transistors (MESFETS), and components formatted for the worldwide interoperability for microwave access standard; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices

Classification Information


International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateFriday, February 5, 2021
Primary Code009
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateFriday, February 5, 2021
Primary Code040
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateFriday, February 5, 2021
Primary Code042
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameWOLFSPEED, INC.
Party Type21 - New Owner After Publication
Legal Entity Type03 - Corporation
AddressDURHAM, NC 27703

Party NameCree, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressDurham, NC 27703

Party NameCree, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressDurham, NC 27703

Trademark Events


Event DateEvent Description
Friday, January 19, 2024NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Thursday, January 18, 2024SOU EXTENSION 5 GRANTED
Thursday, December 28, 2023SOU EXTENSION 5 FILED
Tuesday, January 16, 2024CASE ASSIGNED TO INTENT TO USE PARALEGAL
Thursday, December 28, 2023SOU TEAS EXTENSION RECEIVED
Tuesday, June 27, 2023NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Friday, June 23, 2023SOU EXTENSION 4 GRANTED
Friday, June 23, 2023SOU EXTENSION 4 FILED
Friday, June 23, 2023SOU TEAS EXTENSION RECEIVED
Tuesday, December 27, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Friday, December 23, 2022SOU EXTENSION 3 GRANTED
Friday, December 23, 2022SOU EXTENSION 3 FILED
Friday, December 23, 2022SOU TEAS EXTENSION RECEIVED
Friday, July 1, 2022NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, June 29, 2022SOU EXTENSION 2 GRANTED
Wednesday, June 29, 2022SOU EXTENSION 2 FILED
Wednesday, June 29, 2022SOU TEAS EXTENSION RECEIVED
Wednesday, December 22, 2021NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Monday, December 20, 2021SOU EXTENSION 1 GRANTED
Monday, December 20, 2021SOU EXTENSION 1 FILED
Monday, December 20, 2021SOU TEAS EXTENSION RECEIVED
Wednesday, October 27, 2021AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Tuesday, June 29, 2021NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, May 4, 2021OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, May 4, 2021PUBLISHED FOR OPPOSITION
Wednesday, April 14, 2021NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Friday, March 26, 2021APPROVED FOR PUB - PRINCIPAL REGISTER
Friday, March 26, 2021EXAMINER'S AMENDMENT ENTERED
Friday, March 26, 2021NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Friday, March 26, 2021EXAMINERS AMENDMENT E-MAILED
Friday, March 26, 2021EXAMINERS AMENDMENT -WRITTEN
Tuesday, March 23, 2021EXAMINER'S AMENDMENT ENTERED
Tuesday, March 23, 2021NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Tuesday, March 23, 2021EXAMINERS AMENDMENT E-MAILED
Tuesday, March 23, 2021EXAMINERS AMENDMENT -WRITTEN
Saturday, March 20, 2021ASSIGNED TO EXAMINER
Friday, February 5, 2021NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Friday, December 4, 2020NEW APPLICATION ENTERED