LAIRD Trademark

Trademark Overview


On Tuesday, July 8, 2025, a trademark application was filed for LAIRD with the United States Patent and Trademark Office. The USPTO has given the LAIRD trademark a serial number of 99273013. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Tuesday, July 8, 2025. This trademark is owned by Laird Technologies, Inc.. The LAIRD trademark is filed in the Rubber Products category with the following description:

Microwave absorbers, namely, pastes, pads, and gels; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics; Thermal interface materials and phase change thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces...
laird

General Information


Serial Number99273013
Word MarkLAIRD
Filing DateTuesday, July 8, 2025
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateTuesday, July 8, 2025
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesMicrowave absorbers, namely, pastes, pads, and gels; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics; Thermal interface materials and phase change thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermally conductive PCB (printed circuit board) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; Thermally conductive thermoplastics, namely, semiprocessed thermoplastics in molded, extruded, and sheet form; Conductive plastics and elastomers, namely, putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices

Classification Information


International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateTuesday, July 8, 2025
Primary Code017
First Use Anywhere DateNOT AVAILABLE
First Use In Commerce DateNOT AVAILABLE

Trademark Owner History


Party NameLaird Technologies, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressChesterfield, MO 63017

Trademark Events


Event DateEvent Description
Tuesday, July 8, 2025NEW APPLICATION ENTERED
Tuesday, July 8, 2025APPLICATION FILING RECEIPT MAILED
Tuesday, July 8, 2025NEW APPLICATION OFFICE SUPPLIED DATA ENTERED