LAIRD Trademark

Trademark Overview


On Wednesday, April 1, 2015, a trademark application was filed for LAIRD with the United States Patent and Trademark Office. The USPTO has given the LAIRD trademark a serial number of 86583661. The federal status of this trademark filing is REGISTERED as of Tuesday, January 8, 2019. This trademark is owned by Laird Technologies, Inc.. The LAIRD trademark is filed in the Rubber Products category with the following description:

Microwave absorbers, namely, pastes, pads, gels, and molded / extruded shapes, comprised of foams, elastomers, and polymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive contacts, namely, fabric over foam contacts, foil over foam contacts, spring contacts, and surface mount device contacts, for providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive foam, namely, sheets, pads, strips, and die-cut shapes, for use in conducting heat and electricity; Conductive tape for electromagnetic radiation shielding in electronic products; Decorative electromagnetic interference (EMI) shielding metals, namely, conductive me...
laird

General Information


Serial Number86583661
Word MarkLAIRD
Filing DateWednesday, April 1, 2015
Status700 - REGISTERED
Status DateTuesday, January 8, 2019
Registration Number5649476
Registration DateTuesday, January 8, 2019
Mark Drawing4000 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateTuesday, August 16, 2016

Trademark Statements


Goods and ServicesMicrowave absorbers, namely, pastes, pads, gels, and molded / extruded shapes, comprised of foams, elastomers, and polymers loaded with magnetic particles; Conducting and protective interlayer conductive materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive contacts, namely, fabric over foam contacts, foil over foam contacts, spring contacts, and surface mount device contacts, for providing an electrical connection between two surfaces in electronic devices; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Conductive foam, namely, sheets, pads, strips, and die-cut shapes, for use in conducting heat and electricity; Conductive tape for electromagnetic radiation shielding in electronic products; Decorative electromagnetic interference (EMI) shielding metals, namely, conductive metal sheets having a decorative finish thereon, for EMI shielding in electronics; structural EMI shielding metals, namely, in the form of metal board level shields; EMI shielding wire mesh and knitted wire, namely, in the form of gaskets; Electromagnetic interference (EMI) shielding products, namely, EMI shielding contacts, EMI spring contacts, EMI shielding user interface shields and EMI combination shields, EMI board level shielding and customer designed EMI shielding; Electromagnetic interference shielding gaskets, namely, fabric over foam gaskets, foil over film gaskets, and fingerstocks; conductive elastomers, namely, synthetic elastomers in the form of pads, or as molded, die cut or extruded shapes, for use as components in electronics; Form-in-place non-metal gaskets for electronic devices; Vent panels, namely, metal plated rigid structures that provide EMI shielding and permit air flow to electronic components; Thermal interface materials and phase change thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermal gap filler pad thermal interface materials, namely, thermally conductive silicone gap fillers for industrial and commercial use; electrically insulating thermal interface materials and electrically conductive thermal interface materials, namely, low thermal resistance interface pads, tapes, sheets, films, and coatings for use as heat transfer interfaces between electronic components and thermal dissipation members; Thermally conductive PCB (printed circuit board) materials, namely, films and sheets made out of resins for use in manufacturing electronic circuit boards; Thermally conductive thermoplastics, namely, semiprocessed thermoplastics in molded, extruded, and sheet form; Conductive plastics and elastomers, namely, putties, greases, pads, and sheets for use in the management of electromagnetic radiation and heat in electronic devices; absorbing plastics and elastomers for use in absorbing electromagnetic radiation in electronic devices

Classification Information


International Class017 - Rubber, gutta-percha, gum, asbestos, mica and goods made from these materials and not included in other classes; plastics in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, not of metal.
US Class Codes001, 005, 012, 013, 035, 050
Class Status Code6 - Active
Class Status DateFriday, April 10, 2015
Primary Code017
First Use Anywhere DateWednesday, December 31, 2003
First Use In Commerce DateWednesday, December 31, 2003

Trademark Owner History


Party NameLaird Technologies, Inc.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressChesterfield, MO 63017

Party NameLaird Technologies, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressChesterfield, MO 63017

Party NameLaird Technologies, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressEarth City, MO 63045

Trademark Events


Event DateEvent Description
Monday, January 8, 2024COURTESY REMINDER - SEC. 8 (6-YR) E-MAILED
Tuesday, January 8, 2019REGISTERED-PRINCIPAL REGISTER
Saturday, December 1, 2018NOTICE OF ACCEPTANCE OF STATEMENT OF USE E-MAILED
Friday, November 30, 2018ALLOWED PRINCIPAL REGISTER - SOU ACCEPTED
Monday, November 5, 2018STATEMENT OF USE PROCESSING COMPLETE
Wednesday, October 10, 2018USE AMENDMENT FILED
Monday, November 5, 2018CASE ASSIGNED TO INTENT TO USE PARALEGAL
Wednesday, October 10, 2018TEAS STATEMENT OF USE RECEIVED
Friday, April 13, 2018NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, April 11, 2018SOU EXTENSION 3 GRANTED
Wednesday, April 11, 2018SOU EXTENSION 3 FILED
Wednesday, April 11, 2018SOU TEAS EXTENSION RECEIVED
Monday, February 19, 2018APPLICANT/CORRESPONDENCE CHANGES (NON-RESPONSIVE) ENTERED
Monday, February 19, 2018TEAS CHANGE OF OWNER ADDRESS RECEIVED
Friday, October 13, 2017NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Wednesday, October 11, 2017SOU EXTENSION 2 GRANTED
Wednesday, October 11, 2017SOU EXTENSION 2 FILED
Wednesday, October 11, 2017SOU TEAS EXTENSION RECEIVED
Wednesday, October 11, 2017TEAS CHANGE OF CORRESPONDENCE RECEIVED
Friday, April 14, 2017NOTICE OF APPROVAL OF EXTENSION REQUEST E-MAILED
Tuesday, April 11, 2017SOU EXTENSION 1 GRANTED
Tuesday, April 11, 2017SOU EXTENSION 1 FILED
Tuesday, April 11, 2017SOU TEAS EXTENSION RECEIVED
Tuesday, October 11, 2016NOA E-MAILED - SOU REQUIRED FROM APPLICANT
Tuesday, August 16, 2016OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED
Tuesday, August 16, 2016PUBLISHED FOR OPPOSITION
Wednesday, July 27, 2016NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED
Friday, July 8, 2016APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, July 6, 2016EXAMINER'S AMENDMENT ENTERED
Wednesday, July 6, 2016NOTIFICATION OF EXAMINERS AMENDMENT E-MAILED
Wednesday, July 6, 2016EXAMINERS AMENDMENT E-MAILED
Wednesday, July 6, 2016EXAMINERS AMENDMENT -WRITTEN
Thursday, January 7, 2016NOTIFICATION OF FINAL REFUSAL EMAILED
Thursday, January 7, 2016FINAL REFUSAL E-MAILED
Thursday, January 7, 2016FINAL REFUSAL WRITTEN
Thursday, December 31, 2015TEAS/EMAIL CORRESPONDENCE ENTERED
Wednesday, December 30, 2015CORRESPONDENCE RECEIVED IN LAW OFFICE
Wednesday, December 30, 2015TEAS RESPONSE TO OFFICE ACTION RECEIVED
Tuesday, July 7, 2015NOTIFICATION OF NON-FINAL ACTION E-MAILED
Tuesday, July 7, 2015NON-FINAL ACTION E-MAILED
Tuesday, July 7, 2015NON-FINAL ACTION WRITTEN
Monday, June 29, 2015ASSIGNED TO EXAMINER
Friday, April 10, 2015NEW APPLICATION OFFICE SUPPLIED DATA ENTERED
Saturday, April 4, 2015NEW APPLICATION ENTERED