KUYA LORD Trademark

Trademark Overview


On Friday, February 27, 2026, a trademark application was filed for KUYA LORD with the United States Patent and Trademark Office. The USPTO has given the KUYA LORD trademark a serial number of 99673789. The federal status of this trademark filing is NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER as of Friday, February 27, 2026. This trademark is owned by Kuya Lord Panciteria LLC. The KUYA LORD trademark is filed in the Staple Food Products category with the following description:

Sauce; Vinegar; Pickle relish; Salad dressing; Chili oil for use as a seasoning or condiment; Savory sauces used as condiments
kuya lord

General Information


Serial Number99673789
Word MarkKUYA LORD
Filing DateFriday, February 27, 2026
Status630 - NEW APPLICATION - RECORD INITIALIZED NOT ASSIGNED TO EXAMINER
Status DateFriday, February 27, 2026
Registration Number0000000
Registration DateNOT AVAILABLE
Mark Drawing4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form
Published for Opposition DateNOT AVAILABLE

Trademark Statements


Goods and ServicesSauce; Vinegar; Pickle relish; Salad dressing; Chili oil for use as a seasoning or condiment; Savory sauces used as condiments
Translation of Words in MarkThe English translation of the Tagalog wording KUYA in the mark is BROTHER.

Classification Information


International Class030 - Coffee, tea, cocoa, sugar, rice, tapioca, sago, artificial coffee; flour and preparations made from cereals, bread, pastry and confectionery, ices; honey, treacle; yeast, baking powder; salt, mustard; vinegar, sauces (condiments); spices; ice.
US Class Codes046
Class Status Code6 - Active
Class Status DateFriday, February 27, 2026
Primary Code030
First Use Anywhere DateTuesday, June 30, 2020
First Use In Commerce DateTuesday, June 30, 2020

Trademark Owner History


Party NameKuya Lord Panciteria LLC
Party Type10 - Original Applicant
Legal Entity Type16 - Limited Liability Company
AddressLos Angeles, CA 90038
US

Trademark Events


Event DateEvent Description
Friday, February 27, 2026NEW APPLICATION ENTERED
Friday, February 27, 2026APPLICATION FILING RECEIPT MAILED