KS KULICKE & SOFFA Trademark

Trademark Overview


On Wednesday, October 24, 2001, a trademark application was filed for KS KULICKE & SOFFA with the United States Patent and Trademark Office. The USPTO has given the KS KULICKE & SOFFA trademark a serial number of 76328761. The federal status of this trademark filing is REGISTERED AND RENEWED as of Friday, June 14, 2024. This trademark is owned by Kulicke & Soffa Investments, Inc.. The KS KULICKE & SOFFA trademark is filed in the Machinery Products, Hand Tool Products, Computer & Software Products & Electrical & Scientific Products, Advertising, Business and Retail Services, Construction & Repair Services, Treatment & Processing of Materials Services, Education & Entertainment Services, and Computer & Software Services & Scientific Services categories with the following description:

Customer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ]

[Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors;] [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ]

Computerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a co...

Hand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders

Dicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ]

Maintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment

Providing on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times

Providing on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and v...
ks kulicke & soffa

General Information


Serial Number76328761
Word MarkKS KULICKE & SOFFA
Filing DateWednesday, October 24, 2001
Status800 - REGISTERED AND RENEWED
Status DateFriday, June 14, 2024
Registration Number2788018
Registration DateTuesday, December 2, 2003
Mark Drawing5 - Drawing with word(s) / letter(s) / number(s) in Stylized form
Published for Opposition DateTuesday, September 9, 2003

Trademark Statements


Goods and ServicesCustomer training in the use of equipment for back-end assembly of semiconductors; [ on-line consulting and advisory services for said training ]
Goods and Services[Providing on-line information regarding packaging trends in the field of back-end assembly of semiconductors; providing technical information in the back-end assembly of semiconductors;] [ assembly services for others, namely, prototype building of mechanical components and printed circuit boards; and wafer bumping services for others, namely, semiconductor assembly services for placement of solder balls onto individual integrated electrical circuits ]
Goods and ServicesComputerized electrical wire bonding machine used in the assembly of semiconductors and wire bonding materials, namely, substrates with copper inlay, [ polymer materials, namely, wire encapsulants applied over wire bonds to lock individual wires in place prior to molding, ] and bonding wires; bonder software, namely, software used to run automated wire bonders attaching bonding wire from the integrated circuit chip to a substrate material; [ dicing equipment, namely, electrical dicing equipment for sawing integrated circuit wafers and other hard materials into usable single components; ] factory automation software, namely, software designed for automated semiconductor material flow and gathering and collecting semiconductor assembly equipment data; [ wafer test products, namely, semiconductor probe cards that test the electrical functionality of an integrated circuit chip; package test products, namely, electrical sockets and contactors for testing the electrical functionality of a completed integrated circuit package; and electrical circuit substrates ]
Goods and ServicesHand-operated wire bonding equipment, namely semiconductor assembly equipment for higher pitch wire bonding applications; hand-operated wire bonding tools used in the assembly of semiconductors, namely die collets, capillaries and wedge bonders
Goods and ServicesDicing blades, namely, power-operated blades attached within dicing equipment to cut semiconductor wafers into individual integrated circuit chips; die attachment equipment, namely, semiconductor assembly equipment for picking up and placing individual silicon chips on a substrate and printed circuit board; [ solder ball placement equipment, namely, semiconductor assembly equipment used to place solder balls onto substrate material; ] wafer bumping equipment, namely, semiconductor assembly equipment for bonding stud bumps onto a silicon wafer; [ and wafer preparation equipment, namely, semiconductor assembly equipment for placing the wafer onto a plastic membrane and metal frame ]
Goods and ServicesMaintenance and refurbishment of equipment used in back-end assembly of semiconductors, namely, integrated circuit ball bonders, wedge bonders, manual wire bonders, [ automated dicing equipment, ] ribbon bonders, stud bumpers, [ wafer preparation equipment, testing equipment and ball attachment equipment; ] on-line consulting and advisory services for said equipment maintenance and refurbishment
Indication of Colors claimedColor is not claimed as a feature of the mark.
Goods and ServicesProviding on-line electronic commerce services, namely, on-line catalog for selection, [ ordering and payment ] of products and services, namely, automatic wire bonding equipment, tools and materials, bonder software, die attachment equipment, dicing [ equipment and ] blades, factory automation products and services, [ electrical circuit substrates, ] manual wire bonding equipment, [ solder ball placement equipment, ] wafer bumping equipment, wafer bumping services, [ wafer preparation equipment, wafer test products and package test products, ] and on-line customer support services [ relating thereto ], namely, on-line supply, on-line logistics and support, on-line consulting services for factory productivity consisting of monitoring semiconductor equipment status and collecting data and managing process programs in local and distant manufacturing plants to enhance overall yields and reduce cycle times
Goods and ServicesProviding on-line information regarding software developments in the field of semiconductor manufacturing; providing on-line information regarding technical packaging application support, namely, design of new bonding capillaries based on customer-specific capillary configurations; [ on-line design for others in the field of semiconductor packaging assembly, namely, semiconductor packaging product design application support for the development, testing and assembly of new electrical circuits, all in the field of back-end assembly of semiconductors; providing customized on-line web pages featuring user-defined information, which includes search engines and on-line web links to other web sites; design and fabrication services for others, namely, design and engineering of electrical printed circuit boards used in the semiconductor industry and the design and manufacturing of digital, analog and mix signal circuit boards; ] technical support services rendered in person, via telephone and via global computer network relating to the use of equipment used for the back-end assembly of semiconductors and installation of spare parts therefor

Classification Information


International Class007 - Machines and machine tools; motors and engines (except for land vehicles); machine coupling and transmission components (except for land vehicles); agricultural implements other than hand-operated; incubators for eggs.
US Class Codes013, 019, 021, 023, 031, 034, 035
Class Status Code6 - Active
Class Status DateThursday, September 12, 2002
Primary Code007
First Use Anywhere DateSunday, April 30, 2000
First Use In Commerce DateSunday, April 30, 2000

International Class008 - Hand tools and implements (hand-operated); cutlery; side arms; razors.
US Class Codes023, 028, 044
Class Status Code6 - Active
Class Status DateThursday, September 12, 2002
Primary Code008
First Use Anywhere DateSunday, April 30, 2000
First Use In Commerce DateSunday, April 30, 2000

International Class009 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; automatic vending machines and mechanisms for coin operated apparatus; cash registers, calculating machines, data processing equipment and computers; fire extinguishing apparatus.
US Class Codes021, 023, 026, 036, 038
Class Status Code6 - Active
Class Status DateMonday, November 5, 2001
Primary Code009
First Use Anywhere DateSunday, April 30, 2000
First Use In Commerce DateSunday, April 30, 2000

International Class035 - Advertising; business management; business administration; office functions.
US Class Codes100, 101, 102
Class Status Code6 - Active
Class Status DateMonday, November 5, 2001
Primary Code035
First Use Anywhere DateSaturday, June 30, 2001
First Use In Commerce DateSaturday, June 30, 2001

International Class037 - Building construction; repair; installation services.
US Class Codes100, 103, 106
Class Status Code6 - Active
Class Status DateMonday, November 5, 2001
Primary Code037
First Use Anywhere DateSunday, April 30, 2000
First Use In Commerce DateSunday, April 30, 2000

International Class040 - Treatment of materials.
US Class Codes100, 103, 106
Class Status CodeB - Sec. 8 - Class(es) in a Multiple Class registration
Class Status DateFriday, June 14, 2024
Primary Code040
First Use Anywhere DateWednesday, February 28, 2001
First Use In Commerce DateWednesday, February 28, 2001

International Class041 - Education; providing of training; entertainment; sporting and cultural activities.
US Class Codes100, 101, 107
Class Status Code6 - Active
Class Status DateMonday, November 5, 2001
Primary Code041
First Use Anywhere DateSunday, April 30, 2000
First Use In Commerce DateSunday, April 30, 2000

International Class042 - Scientific and technological services and research and design relating thereto; industrial analysis and research services; design and development of computer hardware and software.
US Class Codes100, 101
Class Status Code6 - Active
Class Status DateMonday, November 5, 2001
Primary Code042
First Use Anywhere DateWednesday, February 28, 2001
First Use In Commerce DateWednesday, February 28, 2001

Trademark Owner History


Party NameKULICKE AND SOFFA INDUSTRIES, INC.
Party Type32 - New Owner After Registration
Legal Entity Type03 - Corporation
AddressFORT WASHINGTON, PA 19034

Party NameKULICKE AND SOFFA INDUSTRIES, INC.
Party Type31 - New Owner After Registration
Legal Entity Type03 - Corporation
AddressFORT WASHINGTON, PA 19034

Party NameKulicke & Soffa Investments, Inc.
Party Type30 - Original Registrant
Legal Entity Type03 - Corporation
AddressWilmington, DE 19808

Party NameKulicke & Soffa Investments, Inc.
Party Type20 - Owner at Publication
Legal Entity Type03 - Corporation
AddressWilmington, DE 19808

Party NameKulicke & Soffa Investments, Inc.
Party Type10 - Original Applicant
Legal Entity Type03 - Corporation
AddressWilmington, DE 19808

Trademark Events


Event DateEvent Description
Friday, December 14, 2001CORRESPONDENCE RECEIVED IN LAW OFFICE
Friday, December 14, 2001PRELIMINARY/VOLUNTARY AMENDMENT - ENTERED
Friday, February 22, 2002ASSIGNED TO EXAMINER
Monday, February 25, 2002NON-FINAL ACTION MAILED
Monday, August 26, 2002PAPER RECEIVED
Monday, August 26, 2002CORRESPONDENCE RECEIVED IN LAW OFFICE
Thursday, October 10, 2002FINAL REFUSAL MAILED
Friday, April 11, 2003PAPER RECEIVED
Friday, April 25, 2003EXPARTE APPEAL RECEIVED AT TTAB
Monday, June 30, 2003APPROVED FOR PUB - PRINCIPAL REGISTER
Wednesday, August 20, 2003NOTICE OF PUBLICATION
Tuesday, September 9, 2003PUBLISHED FOR OPPOSITION
Tuesday, December 2, 2003REGISTERED-PRINCIPAL REGISTER
Wednesday, December 3, 2003EXPARTE APPEAL TERMINATED
Wednesday, December 2, 2009TEAS SECTION 8 & 15 RECEIVED
Friday, September 27, 2002ASSIGNED TO EXAMINER
Tuesday, April 29, 2003EX PARTE APPEAL-INSTITUTED
Monday, May 12, 2003JURISDICTION RESTORED TO EXAMINING ATTORNEY
Tuesday, May 20, 2003CASE FILE IN TICRS
Wednesday, December 9, 2009AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Saturday, December 12, 2009CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Wednesday, December 16, 2009AUTOMATIC UPDATE OF ASSIGNMENT OF OWNERSHIP
Friday, May 30, 2014TEAS SECTION 8 & 9 RECEIVED
Tuesday, June 17, 2014CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Monday, January 4, 2010REGISTERED - SEC. 8 (6-YR) ACCEPTED & SEC. 15 ACK.
Tuesday, June 17, 2014NOTICE OF ACCEPTANCE OF SEC. 8 & 9 - E-MAILED
Friday, December 2, 2022COURTESY REMINDER - SEC. 8 (10-YR)/SEC. 9 E-MAILED
Wednesday, March 13, 2024TEAS SECTION 8 & 9 RECEIVED
Friday, June 14, 2024CASE ASSIGNED TO POST REGISTRATION PARALEGAL
Friday, June 14, 2024REGISTERED - SEC. 9 GRANTED/CHECK RECORD FOR SEC. 8
Friday, June 14, 2024REGISTERED AND RENEWED (SECOND RENEWAL - 10 YRS)
Friday, June 14, 2024REGISTERED - PARTIAL SEC. 8 (10-YR) ACCEPTED
Friday, June 14, 2024NOTICE OF ACCEPTANCE OF SEC. 8 - E-MAILED
Monday, January 29, 2018ATTORNEY/DOM.REP.REVOKED AND/OR APPOINTED
Tuesday, June 17, 2014REGISTERED - SEC. 8 (10-YR) ACCEPTED/SEC. 9 GRANTED
Tuesday, June 17, 2014REGISTERED AND RENEWED (FIRST RENEWAL - 10 YRS)
Monday, January 29, 2018TEAS REVOKE/APP/CHANGE ADDR OF ATTY/DOM REP RECEIVED