| Serial Number | 79402734 |
| Word Mark | KOTETSU |
| Filing Date | Monday, July 1, 2024 |
| Status | 661 - RESPONSE AFTER NON-FINAL ACTION - ENTERED |
| Status Date | Friday, March 28, 2025 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | NOT AVAILABLE |
| Goods and Services | Nonferrous metals and their alloys; unwrought or semi-wrought copper and its alloys; lead and its alloys; tin and its alloys; solders, namely, soft solder, solder pastes, solder wires, solder cream; solder alloys, namely, soft solder, solder pastes, solder wires, solder cream; silver solder; gold solder; lead-free solder, namely, soft solder, solder pastes, solder wires, solder cream; solder in the form of ball, namely, soft solder; solder in the form of rod, namely, soft solder; solder in the form of bar, namely, soft solder; solder with grease, namely, soft solder, solder pastes; soldering wire of metal; solder in the form of paste; solder in the form of powder, namely, soft solder. |
| International Class | 006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores. |
| US Class Codes | 002, 012, 013, 014, 023, 025, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, August 22, 2024 |
| Primary Code | 006 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
| Party Name | SENJU METAL INDUSTRY CO., LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Event Date | Event Description |
| Thursday, August 22, 2024 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Wednesday, November 6, 2024 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Saturday, December 28, 2024 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Wednesday, November 6, 2024 | APPLICATION FILING RECEIPT MAILED |
| Friday, December 27, 2024 | NON-FINAL ACTION WRITTEN |
| Friday, December 27, 2024 | ASSIGNED TO EXAMINER |
| Thursday, January 30, 2025 | REFUSAL PROCESSED BY MPU |
| Friday, March 28, 2025 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Friday, March 28, 2025 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Friday, March 28, 2025 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Saturday, February 15, 2025 | REFUSAL PROCESSED BY IB |
| Thursday, January 30, 2025 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |