KOTETSU Trademark
Trademark Overview
On Monday, July 1, 2024, a trademark application was filed for KOTETSU with the United States Patent and Trademark Office. The USPTO has given the KOTETSU trademark a serial number of 79402734. The federal status of this trademark filing is PUBLISHED FOR OPPOSITION as of Tuesday, May 13, 2025. This trademark is owned by SENJU METAL INDUSTRY CO., LTD.. The KOTETSU trademark is filed in the Metal Products category with the following description:
Nonferrous metals and their alloys; unwrought or semi-wrought copper and its alloys; lead and its alloys; tin and its alloys; solders, namely, soft solder, solder pastes, solder wires, solder cream; solder alloys, namely, soft solder, solder pastes, solder wires, solder cream; silver solder; gold solder; lead-free solder, namely, soft solder, solder pastes, solder wires, solder cream; solder in the form of ball, namely, soft solder; solder in the form of rod, namely, soft solder; solder in the form of bar, namely, soft solder; solder with grease, namely, soft solder, solder pastes; soldering wire of metal; solder in the form of paste; solder in the form of powder, namely, soft solder.
General Information
| Serial Number | 79402734 |
| Word Mark | KOTETSU |
| Filing Date | Monday, July 1, 2024 |
| Status | 686 - PUBLISHED FOR OPPOSITION |
| Status Date | Tuesday, May 13, 2025 |
| Registration Number | 0000000 |
| Registration Date | NOT AVAILABLE |
| Mark Drawing | 4 - Illustration: Drawing with word(s) / letter(s) / number(s) in Block form |
| Published for Opposition Date | Tuesday, May 13, 2025 |
Trademark Statements
| Goods and Services | Nonferrous metals and their alloys; unwrought or semi-wrought copper and its alloys; lead and its alloys; tin and its alloys; solders, namely, soft solder, solder pastes, solder wires, solder cream; solder alloys, namely, soft solder, solder pastes, solder wires, solder cream; silver solder; gold solder; lead-free solder, namely, soft solder, solder pastes, solder wires, solder cream; solder in the form of ball, namely, soft solder; solder in the form of rod, namely, soft solder; solder in the form of bar, namely, soft solder; solder with grease, namely, soft solder, solder pastes; soldering wire of metal; solder in the form of paste; solder in the form of powder, namely, soft solder. |
Classification Information
| International Class | 006 - Common metals and their alloys; metal building materials; transportable buildings of metal; materials of metal for railway tracks; nonelectric cables and wires of common metal; ironmongery, small items of metal hardware; pipes and tubes of metal; safes; goods of common metal not included in other classes; ores. |
| US Class Codes | 002, 012, 013, 014, 023, 025, 050 |
| Class Status Code | 6 - Active |
| Class Status Date | Thursday, August 22, 2024 |
| Primary Code | 006 |
| First Use Anywhere Date | NOT AVAILABLE |
| First Use In Commerce Date | NOT AVAILABLE |
Trademark Owner History
| Party Name | SENJU METAL INDUSTRY CO., LTD. |
| Party Type | 20 - Owner at Publication |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
| Party Name | SENJU METAL INDUSTRY CO., LTD. |
| Party Type | 10 - Original Applicant |
| Legal Entity Type | 03 - Corporation |
| Address | JP |
Trademark Events
| Event Date | Event Description |
| Thursday, August 22, 2024 | SN ASSIGNED FOR SECT 66A APPL FROM IB |
| Wednesday, November 6, 2024 | NEW APPLICATION OFFICE SUPPLIED DATA ENTERED |
| Wednesday, November 6, 2024 | APPLICATION FILING RECEIPT MAILED |
| Friday, December 27, 2024 | NON-FINAL ACTION WRITTEN |
| Thursday, January 30, 2025 | REFUSAL PROCESSED BY MPU |
| Friday, December 27, 2024 | ASSIGNED TO EXAMINER |
| Saturday, December 28, 2024 | NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW |
| Thursday, January 30, 2025 | NON-FINAL ACTION MAILED - REFUSAL SENT TO IB |
| Saturday, February 15, 2025 | REFUSAL PROCESSED BY IB |
| Friday, March 28, 2025 | CORRESPONDENCE RECEIVED IN LAW OFFICE |
| Friday, March 28, 2025 | TEAS RESPONSE TO OFFICE ACTION RECEIVED |
| Friday, March 28, 2025 | TEAS/EMAIL CORRESPONDENCE ENTERED |
| Thursday, April 10, 2025 | APPROVED FOR PUB - PRINCIPAL REGISTER |
| Wednesday, May 7, 2025 | NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED |
| Tuesday, May 13, 2025 | PUBLISHED FOR OPPOSITION |
| Tuesday, May 13, 2025 | OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED |
