Semiconductor chips and chip sets

SEMICONDUCTOR PACKAGING FOR MANUFACTURERS OF SEMICONDUCTORS AND DEVICES UTILIZING SEMICONDUCTORS, NAMELY, UNDER BUMP METALIZATION, POLYMER THIN FILM LAYERS AND SOLDER BUMPS CONSTRUCTED ON SEMICONDUCTOR WAFER TO PROTECT THE INTEGRATED CIRCUIT FROM CONTAMINANTS AND MOISTURE AND TO MAKE AN ELECTRICAL CONNECTION BETWEEN THE INTEGRATED CIRCUIT CHIP AND PRINTED CIRCUIT BOARD OR OTHER SUBSTRATES

Cases for contact lenses; Cases for eyeglasses and sunglasses; Cases for spectacles, for pince-nez and for contact lenses; Contact lenses; Containers for contact lenses; Corrective glasses; Eye glass cases; Eye glass chains; Eye glass cords; Eye glasses; Eyeglass cases; Eyeglass chains; Eyeglass cords; Eyeglass frames; Eyeglass lanyards; Eyeglass lenses; Eyeglasses; Ophthalmic lenses; Optical lenses; Pince-nez; Pince-nez chains; Pince-nez cords; Pince-nez mountings; Protective eyeglasses; Spe...

Air humidifying apparatus; Air impellers for ventilation; Air purification units; Air sterilisers; Bicycle lamps; Bicycle reflectors; Blankets, electric, not for medical purposes; Clothes drying machines; Directional lights for bicycles; Electric hand drying apparatus for washrooms; Electric space heaters; Portable headlamps