Evening handbags; Fashion handbags; Handbags; Handbags, purses and wallets; Leather bags and wallets; Leather handbags; Leather purses; Multi-purpose purses; Purses; Purses and wallets; Wallets

Headphones; Intercoms; Communications headsets for use with communication radios, intercom systems, or other communications network transceivers; Cordless telephones; Earpieces for remote communication; Headsets for cellular or mobile phones; Headsets for mobile telephones; Headsets for telephones; Headsets for use with computers; Personal headphones for use with sound transmitting systems; Phase shifters for communications apparatus; Radio sets; Telephone headsets; Telephone sets; Vehicle ra...

Coifs; Leather shoes; Scarves; Shawls; Suits; Suspenders; Sweaters; Swim caps; Swimming costumes; Thong beachwear; Waistbands; Wedding dresses; Wind coats; Women's underwear; Yoga pants

Corkboard pins; Decals and stickers for use as home decor; Decorative decals for vehicle windows; Desk mats; Folders for papers; Framed art prints; Free-standing and wall-mounted paper and cardboard boxes for depositing a written message or prayer wishing a loved one well, for use in hospitals, elder care residences, schools, and institutions for children with special needs; Office stationery; Paper backdrops for use in photography; Printed desk top planners; Printed guest books; Printed news...

Luggage; Schoolbags; Baby backpacks; Baby carrying bags; Backpacks, book bags, sports bags, bum bags, wallets and handbags; Bags for sports; Beach umbrellas; Cosmetic bags sold empty; Handbags, purses and wallets; Leather bags, suitcases and wallets; Leather cases; Net bags for shopping; Pet clothing; Shoulder bags; Travel bags

Electronic and electrical components, namely, semiconductor chips comprised of semiconductor dies, substrates, interconnects, ball connections, pads and traces; integrated circuit packages comprised of semiconductor dies, substrates, interconnects, ball connections, pads and traces, and parts thereof

Electronic and electrical components, namely, semiconductor chips comprised of semiconductor dies, substrates, interconnects, ball connections, pads and traces; integrated circuit packages comprised of semiconductor dies, substrates, interconnects, ball connections, pads and traces, and parts thereof

Jewelry