Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, glass substrates, and electronic circuit boards; polishing pads for polishing machines for use in the manufacture of semiconductor wafers, glass substrates, and electronic circuit boards; polishing pads being parts of machines for use in the manufacture of semiconductor wafers, glass substrates, and electronic circuit boards within...