Manufacture of desk and writing accessories for retail banks, modular desks and counters for check writing in the nature of check desks, center pieces for check desks that incorporate captive chain-type pens, metal calendars, form holders for deposit and withdraw slips and waste doors, crowd control directional barriers, desk sets, captive chain-type pens, metal calendars, form holders, desk calendars, waste baskets, furniture and accessories to order and/or specification of others

Desk and Bank Customer Counter Accessories-Namely, Letter Trays, Desk Calendars, Desk Pen and Pad Holders, Desk Pads, Pencil Trays, Book End Blocks, and Captive Chain-Type Pens

Desk and Bank Customer Counter Accessories-Namely, Letter Trays, Desk Calendars, Desk Pen and Pad Holders, Desk Pads, Pencil Trays, Book End Blocks, and Captive Chain-Type Pens

Printed circuit boards; chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, semiconductor packaging for manufacturers of systems and devices utilizing semiconductors in the nature of dies, substrates, interposers, wire bond and solder bumps, semiconductor packaging for manufacturers of circuitized lead frames and semiconductor packaging for manufacturers of circuit boards used to protect integrated circuits from contaminants, mo...

Printed circuit boards; and, chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, systems and devices utilizing semiconductors, namely, dies, substrates, interposers, wire bond and solder bumps, circuitized lead frames and circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuit

printed circuit boards; chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, semiconductor packaging for manufacturers of systems and devices utilizing semiconductors in the nature of dies, substrates, interposers, wire bond and solder bumps, semiconductor packaging for manufacturers of circuitized lead frames and semiconductor packaging for manufacturers of circuit boards used to protect integrated circuits from contaminants, mo...